Datasheet ADP1715, ADP1716 (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | 500 mA, Low Dropout, CMOS Linear Regulator |
| Seiten / Seite | 20 / 4 — ADP1715/ADP1716. ABSOLUTE MAXIMUM RATINGS. Table 2. THERMAL RESISTANCE. … |
| Dateiformat / Größe | PDF / 613 Kb |
| Dokumentensprache | Englisch |
ADP1715/ADP1716. ABSOLUTE MAXIMUM RATINGS. Table 2. THERMAL RESISTANCE. Parameter Rating. Table 3. Thermal Resistance. Package Type
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Textversion des Dokuments
ADP1715/ADP1716 ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN EN to GND –0.3 V to +6 V
Table 3. Thermal Resistance
SS/ADJ/TRK to GND –0.3 V to +6 V
Package Type θJA Unit
Storage Temperature Range –65°C to +150°C 8-Lead MSOP 118 °C/W Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 4 of 20 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT-START FUNCTION (ADP1715) ADJUSTABLE OUTPUT VOLTAGE (ADP1715 ADJUSTABLE) TRACK MODE (ADP1716) ENABLE FEATURE APPLICATION INFORMATION CAPACITOR SELECTION CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device IN to GND –0.3 V to +6 V soldered in a circuit board for surface-mount packages. OUT to GND –0.3 V to IN EN to GND –0.3 V to +6 V
Table 3. Thermal Resistance
SS/ADJ/TRK to GND –0.3 V to +6 V
Package Type θJA Unit
Storage Temperature Range –65°C to +150°C 8-Lead MSOP 118 °C/W Operating Junction Temperature Range –40°C to +125°C Soldering Conditions JEDEC J-STD-020
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Rev. 0 | Page 4 of 20 Document Outline FEATURES APPLICATIONS TYPICAL APPLICATION CIRCUITS GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION SOFT-START FUNCTION (ADP1715) ADJUSTABLE OUTPUT VOLTAGE (ADP1715 ADJUSTABLE) TRACK MODE (ADP1716) ENABLE FEATURE APPLICATION INFORMATION CAPACITOR SELECTION CURRENT LIMIT AND THERMAL OVERLOAD PROTECTION THERMAL CONSIDERATIONS PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS OUTLINE DIMENSIONS ORDERING GUIDE