Datasheet ADCMP608 (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | Rail-to-Rail, Fast, Low Power 2.5 V to 5.5 V, Single-Supply TTL/CMOS Comparator |
| Seiten / Seite | 10 / 4 — ADCMP608. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL … |
| Revision | B |
| Dateiformat / Größe | PDF / 237 Kb |
| Dokumentensprache | Englisch |
ADCMP608. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE. Parameter Rating. Table 3. Thermal Resistance
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ADCMP608 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device Supply Voltages soldered in a circuit board for surface-mount packages. Supply Voltage (VCC to GND) −0.5 V to +6.0 V
Table 3. Thermal Resistance
Supply Differential −6.0 V to +6.0 V
Package Type θ 1 JA Unit
Input Voltages ADCMP608 6-Lead SC70 426 °C/W Input Voltage −0.5 V to VCC+ 0.5 V 1 Measurement in still air. Differential Input Voltage ±(VCC + 0.5 V) Maximum Input/Output Current ±50 mA Shutdown Control Pin
ESD CAUTION
Applied Voltage (SDN to GND) −0.5 V to VCC + 0.5 V Maximum Input/Output Current ±50 mA Output Current ±50 mA Temperature Operating Temperature, Ambient −40°C to +125°C Operating Temperature, Junction 150°C Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 4 of 10 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION POWER/GROUND LAYOUT AND BYPASSING TTL-/CMOS-COMPATIBLE OUTPUT STAGE OPTIMIZING PERFORMANCE COMPARATOR PROPAGATION DELAY DISPERSION CROSSOVER BIAS POINT MINIMUM INPUT SLEW RATE REQUIREMENT TYPICAL APPLICATION CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE
θJA is specified for the worst-case conditions, that is, a device Supply Voltages soldered in a circuit board for surface-mount packages. Supply Voltage (VCC to GND) −0.5 V to +6.0 V
Table 3. Thermal Resistance
Supply Differential −6.0 V to +6.0 V
Package Type θ 1 JA Unit
Input Voltages ADCMP608 6-Lead SC70 426 °C/W Input Voltage −0.5 V to VCC+ 0.5 V 1 Measurement in still air. Differential Input Voltage ±(VCC + 0.5 V) Maximum Input/Output Current ±50 mA Shutdown Control Pin
ESD CAUTION
Applied Voltage (SDN to GND) −0.5 V to VCC + 0.5 V Maximum Input/Output Current ±50 mA Output Current ±50 mA Temperature Operating Temperature, Ambient −40°C to +125°C Operating Temperature, Junction 150°C Storage Temperature Range −65°C to +150°C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. B | Page 4 of 10 Document Outline FEATURES APPLICATIONS FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS APPLICATIONS INFORMATION POWER/GROUND LAYOUT AND BYPASSING TTL-/CMOS-COMPATIBLE OUTPUT STAGE OPTIMIZING PERFORMANCE COMPARATOR PROPAGATION DELAY DISPERSION CROSSOVER BIAS POINT MINIMUM INPUT SLEW RATE REQUIREMENT TYPICAL APPLICATION CIRCUITS OUTLINE DIMENSIONS ORDERING GUIDE