Datasheet BLF978P (Ampleon) - 2
| Hersteller | Ampleon |
| Beschreibung | HF / VHF power LDMOS transistor |
| Seiten / Seite | 15 / 2 — BLF978P. HF / VHF power LDMOS transistor. 2. Pinning. information. Table … |
| Dateiformat / Größe | PDF / 1.5 Mb |
| Dokumentensprache | Englisch |
BLF978P. HF / VHF power LDMOS transistor. 2. Pinning. information. Table 2. Pinning. Pin. Description. Simplified outline. Graphic symbol
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BLF978P HF / VHF power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol
1 drain1 1 2 1 2 drain2 3 gate1 5 3 4 gate2 3 4 5 4 5 source [1] 2 sym117 [1] Connected to flange.
3. Ordering information Table 3. Ordering information Type number Package Name Description Version
BLF978P - flanged balanced ceramic package; 2 mounting holes; SOT539A 4 leads
4. Limiting values Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage - 108 V VGS gate-source voltage 6 +11 V Tstg storage temperature 65 +150 C Tj junction temperature [1] - 225 C [1] Continuous use at maximum temperature will affect the reliability, for details refer to the online MTF calculator.
5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit
Rth(j-c) thermal resistance from junction to case Tcase = 90 C [1] 0.121 K/W Z [2] th(j-c) transient thermal impedance from Tcase = 90 C; tp = 100 s; 0.033 K/W junction to case = 10 % [1] Rth(j-c) is measured under RF conditions. [2] See Figure 1. BLF978P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2020. All rights reserved.
Product data sheet Rev. 1 — 3 April 2020 2 of 15
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Application information 8. Test information 8.1 Ruggedness in class-AB operation 8.2 Impedance information 8.3 Test circuit 8.4 Graphical data 8.4.1 1-Tone CW pulsed 9. Package outline 10. Handling information 11. Abbreviations 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents
BLF978P HF / VHF power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol
1 drain1 1 2 1 2 drain2 3 gate1 5 3 4 gate2 3 4 5 4 5 source [1] 2 sym117 [1] Connected to flange.
3. Ordering information Table 3. Ordering information Type number Package Name Description Version
BLF978P - flanged balanced ceramic package; 2 mounting holes; SOT539A 4 leads
4. Limiting values Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDS drain-source voltage - 108 V VGS gate-source voltage 6 +11 V Tstg storage temperature 65 +150 C Tj junction temperature [1] - 225 C [1] Continuous use at maximum temperature will affect the reliability, for details refer to the online MTF calculator.
5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Typ Unit
Rth(j-c) thermal resistance from junction to case Tcase = 90 C [1] 0.121 K/W Z [2] th(j-c) transient thermal impedance from Tcase = 90 C; tp = 100 s; 0.033 K/W junction to case = 10 % [1] Rth(j-c) is measured under RF conditions. [2] See Figure 1. BLF978P All information provided in this document is subject to legal disclaimers. © Ampleon Netherlands B.V. 2020. All rights reserved.
Product data sheet Rev. 1 — 3 April 2020 2 of 15
Document Outline 1. Product profile 1.1 General description 1.2 Features and benefits 1.3 Applications 2. Pinning information 3. Ordering information 4. Limiting values 5. Thermal characteristics 6. Characteristics 7. Application information 8. Test information 8.1 Ruggedness in class-AB operation 8.2 Impedance information 8.3 Test circuit 8.4 Graphical data 8.4.1 1-Tone CW pulsed 9. Package outline 10. Handling information 11. Abbreviations 12. Revision history 13. Legal information 13.1 Data sheet status 13.2 Definitions 13.3 Disclaimers 13.4 Trademarks 14. Contact information 15. Contents