Datasheet LTM4643 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Ultrathin Quad μModule Regulator with Configurable 3A Output Array |
| Seiten / Seite | 32 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| Revision | D |
| Dateiformat / Größe | PDF / 2.3 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Modelllinie für dieses Datenblatt
Textversion des Dokuments
LTM4643
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V TOP VIEW IN, SVIN (Per Channel) .. –0.3V to 22V VIN1 TRACK/SS1 VOUT (Per Channel) (Note 3) ..–0.3V to SVIN or 6V 1 2 3 4 5 6 7 RUN (Per Channel) ... –0.3V to 22V VOUT1 GND FB1 A INTV SVIN1 GND CC (Per Channel) ... –0.3V to 3.6V MODE1 B COMP1 PGOOD, MODE, TRACK/SS, RUN1 C CLKIN FB (Per Channel) ...–0.3V to INTVCC V PGOOD2 PGOOD1 INTV OUT2 CC1 TRACK/SS2 CLKOUT (Note 3), CLKIN ...–0.3V to INTV D FB2 CC SV GND IN2 MODE2 Internal Operating Temperature Range E COMP2 VIN2 RUN2 (Notes 2, 5) .. –40°C to 125°C F SGND V PGOOD3 TEMP INTV OUT3 CC2 TRACK/SS3 Storage Temperature Range .. –65°C to 150°C G FB3 SVIN3 GND Peak Solder Reflow Body Temperature ...260°C MODE3 H COMP3 VIN3 INTVCC3 RUN3 J FB4 VOUT4 PGOOD4 CLKOUT TRACK/SS4 K RUN4 GND INTVCC4 L COMP4 VIN4 SVIN4 MODE4 LGA PACKAGE (WEIGHT = 0.70g) 77-LEAD (9mm × 15mm × 1.82mm) BGA PACKAGE (WEIGHT = 0.83g) 77-LEAD (9mm × 15mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 2.75°C/W, θJB + θBA = 11°C/W, θJA = 10°C/W θ VALUES PER JESD 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4643EV#PBF Au (RoHS) LTM4643V e4 LGA 3 –40°C to 125°C LTM4643IV#PBF Au (RoHS) LTM4643V e4 LGA 3 –40°C to 125°C LTM4643MPV#PBF Au (RoHS) LTM4643V e4 LGA 3 –55°C to 125°C LTM4643EY#PBF SAC305 (RoHS) LTM4643Y e1 BGA 3 –40°C to 125°C LTM4643IY#PBF SAC305 (RoHS) LTM4643Y e1 BGA 3 –40°C to 125°C LTM4643MPY#PBF SAC305 (RoHS) LTM4643Y e1 BGA 3 –55°C to 125°C LTM4643IY SnPb (63/37) LTM4643Y e0 BGA 3 –40°C to 125°C LTM4643MPY SnPb (63/37) LTM4643Y e0 BGA 3 –55°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings Rev D 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photo Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V TOP VIEW IN, SVIN (Per Channel) .. –0.3V to 22V VIN1 TRACK/SS1 VOUT (Per Channel) (Note 3) ..–0.3V to SVIN or 6V 1 2 3 4 5 6 7 RUN (Per Channel) ... –0.3V to 22V VOUT1 GND FB1 A INTV SVIN1 GND CC (Per Channel) ... –0.3V to 3.6V MODE1 B COMP1 PGOOD, MODE, TRACK/SS, RUN1 C CLKIN FB (Per Channel) ...–0.3V to INTVCC V PGOOD2 PGOOD1 INTV OUT2 CC1 TRACK/SS2 CLKOUT (Note 3), CLKIN ...–0.3V to INTV D FB2 CC SV GND IN2 MODE2 Internal Operating Temperature Range E COMP2 VIN2 RUN2 (Notes 2, 5) .. –40°C to 125°C F SGND V PGOOD3 TEMP INTV OUT3 CC2 TRACK/SS3 Storage Temperature Range .. –65°C to 150°C G FB3 SVIN3 GND Peak Solder Reflow Body Temperature ...260°C MODE3 H COMP3 VIN3 INTVCC3 RUN3 J FB4 VOUT4 PGOOD4 CLKOUT TRACK/SS4 K RUN4 GND INTVCC4 L COMP4 VIN4 SVIN4 MODE4 LGA PACKAGE (WEIGHT = 0.70g) 77-LEAD (9mm × 15mm × 1.82mm) BGA PACKAGE (WEIGHT = 0.83g) 77-LEAD (9mm × 15mm × 2.42mm) TJMAX = 125°C, θJCtop = 17°C/W, θJCbottom = 2.75°C/W, θJB + θBA = 11°C/W, θJA = 10°C/W θ VALUES PER JESD 51-12
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD OR BALL FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTM4643EV#PBF Au (RoHS) LTM4643V e4 LGA 3 –40°C to 125°C LTM4643IV#PBF Au (RoHS) LTM4643V e4 LGA 3 –40°C to 125°C LTM4643MPV#PBF Au (RoHS) LTM4643V e4 LGA 3 –55°C to 125°C LTM4643EY#PBF SAC305 (RoHS) LTM4643Y e1 BGA 3 –40°C to 125°C LTM4643IY#PBF SAC305 (RoHS) LTM4643Y e1 BGA 3 –40°C to 125°C LTM4643MPY#PBF SAC305 (RoHS) LTM4643Y e1 BGA 3 –55°C to 125°C LTM4643IY SnPb (63/37) LTM4643Y e0 BGA 3 –40°C to 125°C LTM4643MPY SnPb (63/37) LTM4643Y e0 BGA 3 –55°C to 125°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Device temperature grade is indicated by a label on the shipping Procedures container. Pad or ball finish code is per IPC/JEDEC J-STD-609. • LGA and BGA Package and Tray Drawings Rev D 2 For more information www.analog.com Document Outline Features Applications Description Typical Application Absolute Maximum Ratings Pin Configuration Order Information Electrical Characteristics Typical Performance Characteristics Pin Functions Block Diagram Decoupling Requirements Operation Applications Information Typical Applications Package Description Package Photo Related Parts