Datasheet HMC983LP5E (Analog Devices) - 9

HerstellerAnalog Devices
BeschreibungDC - 7 GHz Fractional-N Divider and Frequency Sweeper
Seiten / Seite32 / 9 — HMC983LP5E. DC - 7 GHz FRACTIONAL-N DIVIDER. AND FREQUENCY SWEEPER. Table …
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HMC983LP5E. DC - 7 GHz FRACTIONAL-N DIVIDER. AND FREQUENCY SWEEPER. Table 3. Absolute Maximum Ratings. Outline Drawing

HMC983LP5E DC - 7 GHz FRACTIONAL-N DIVIDER AND FREQUENCY SWEEPER Table 3 Absolute Maximum Ratings Outline Drawing

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HMC983LP5E
v02.0112
DC - 7 GHz FRACTIONAL-N DIVIDER AND FREQUENCY SWEEPER Table 3. Absolute Maximum Ratings
nominal 3v supplies to GnD -0.3 to 3.6 v thermal resistance (rth) t (junction to ground paddle) 40 °c/W nominal 3v Digital supply to 3v M -0.3 to +0.3 v Analog supply reflow soldering s Peak temperature 260 °c nominal 5v supply to GnD (vPPBuF) -0.3 to 5.5 v time at Peak temperature 40 s divckp, divckn common mode Dc vccPs + 0.5 v min esD sensitivity (HBM) class 1B s - vcoiP, vcoin single ended Ac 50 Ω + 7 dBm r source o vcoiP, vcoin Differential Ac 50 Ω + 13 dBm t source stresses above those listed under Absolute Maximum ratings may c Digital input voltage range -0.25 to DvDD + 0.5 v cause permanent damage to the device. this is a stress rating only; e Minimum Digital Load 1 kΩ functional operation of the device at these or any other conditions t operating temperature range -40 °c to +85 °c above those indicated in the operational section of this specification is not implied. exposure to absolute maximum rating conditions for e Maximum Junction temperature 125 °c extended periods may affect device reliability. storage temperature -65 to +125 °c eLectrostAtic sensitive Device oBserve HAnDLinG PrecAutions s & D
Outline Drawing
r e iD iv y D c n e u q e r F notes: [1] PAcKAGe BoDy MAteriAL: LoW stress inJection MoLDeD PLAstic siLicA AnD siLicon iMPreGnAteD. [2] LeAD AnD GrounD PADDLe MAteriAL: coPPer ALLoy. [3] LeAD AnD GrounD PADDLe PLAtinG: 100% MAtte tin. [4] DiMensions Are in incHes [MiLLiMeters]. [5] LeAD sPAcinG toLerAnce is non-cuMuLAtive. [6] PAD Burr LenGtH sHALL Be 0.15 mm MAX. PAD Burr HeiGHt sHALL Be 0.25 m MAX. [7] PAcKAGe WArP sHALL not eXceeD 0.05 mm [8] ALL GrounD LeADs AnD GrounD PADDLe Must Be soLDereD to PcB rF GrounD. [9] reFer to Hittite APPLicAtion note For suGGesteD PcB LAnD PAttern.
Package Information
Part number Package Body Material Lead Finish MsL rating [2] Package Marking [1] H983 Dc -7GHz FrActionAL-n DiviDer roHs-compliant Low stress injection Molded Plastic 100% matte sn MsL1 XXXX [1] 4-Digit lot number XXXX [2] Max peak reflow temperature of 260 °c Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd ho e ne r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o tniltie n .c e ao t m
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license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 p 3 o plica r a tio p n S p u s p @ po h rt itt : P ite ho . n c e o : 1m -800-ANALOG-D