Datasheet AD73311L (Analog Devices) - 6
| Hersteller | Analog Devices |
| Beschreibung | a Low Cost, Low Power CMOS General Purpose Analog Front End |
| Seiten / Seite | 36 / 6 — AD73311L. ABSOLUTE MAXIMUM RATINGS*. PIN CONFIGURATION. VOUTP. 20 SE. … |
| Revision | A |
| Dateiformat / Größe | PDF / 391 Kb |
| Dokumentensprache | Englisch |
AD73311L. ABSOLUTE MAXIMUM RATINGS*. PIN CONFIGURATION. VOUTP. 20 SE. VOUTN. 19 SDI. AVDD1 3. 18 SDIFS. AGND1. 17 SDOFS. VINP. AD73311L 16 SDO
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Textversion des Dokuments
AD73311L ABSOLUTE MAXIMUM RATINGS* PIN CONFIGURATION
(TA = 25°C unless otherwise noted) AVDD, DVDD to GND . –0.3 V to +4.6 V AGND to DGND . –0.3 V to +0.3 V
VOUTP 1 20 SE
Digital I/O Voltage to DGND . –0.3 V to (DVDD + 0.3 V)
VOUTN 2 19 SDI
Analog I/O Voltage to AGND . –0.3 V to (AVDD + 0.3 V)
AVDD1 3 18 SDIFS
Operating Temperature Range
AGND1 4 17 SDOFS
Industrial (A Version) . –40°C to +105°C
VINP 5 AD73311L 16 SDO
Storage Temperature Range . –65°C to +150°C
VINN 6 TOP VIEW 15 MCLK
Maximum Junction Temperature . 150°C
(Not to Scale) REFOUT 7 14 SCLK
SOIC, θJA Thermal Impedance . 75°C/W
REFCAP 8 13 RESET
Lead Temperature, Soldering
DVDD
Vapor Phase (60 sec) . 215°C
AVDD2 9 12
Infrared (15 sec) . 220°C
AGND2 10 11 DGND
SSOP, θJA Thermal Impedance . 126°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . 215°C Infrared (15 sec) . 220°C TSSOP, θ
ORDERING GUIDE
JA Thermal Impedance . 143°C/W Lead Temperature, Soldering
Temperature Package
Vapor Phase (60 sec) . 215°C
Model Range Option1
Infrared (15 sec) . 220°C *Stresses above those listed under Absolute Maximum Ratings may cause perma- AD73311LAR –40°C to +105°C R-20 nent damage to the device. This is a stress rating only; functional operation of the AD73311LARS –40°C to +105°C RS-20 device at these or any other conditions above those listed in the operational sections AD73311LARU –40°C to +105°C RU-20 of this specification is not implied. Exposure to absolute maximum rating condi- EVAL-AD73311LEB Evaluation Board2 tions for extended periods may affect device reliability. NOTES 1R = 0.3' Small Outline IC (SOIC), RS = Shrink Small Outline Package (SSOP), RU = Thin Small Shrink Outline Package (TSSOP). 2The AD73311L evaluation board features a cascade of two codecs interfaced to an ADSP-2185L DSP. The board features a DSP software monitor which allows interface to a PC serial port.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD73311L features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality. –6– REV. A
(TA = 25°C unless otherwise noted) AVDD, DVDD to GND . –0.3 V to +4.6 V AGND to DGND . –0.3 V to +0.3 V
VOUTP 1 20 SE
Digital I/O Voltage to DGND . –0.3 V to (DVDD + 0.3 V)
VOUTN 2 19 SDI
Analog I/O Voltage to AGND . –0.3 V to (AVDD + 0.3 V)
AVDD1 3 18 SDIFS
Operating Temperature Range
AGND1 4 17 SDOFS
Industrial (A Version) . –40°C to +105°C
VINP 5 AD73311L 16 SDO
Storage Temperature Range . –65°C to +150°C
VINN 6 TOP VIEW 15 MCLK
Maximum Junction Temperature . 150°C
(Not to Scale) REFOUT 7 14 SCLK
SOIC, θJA Thermal Impedance . 75°C/W
REFCAP 8 13 RESET
Lead Temperature, Soldering
DVDD
Vapor Phase (60 sec) . 215°C
AVDD2 9 12
Infrared (15 sec) . 220°C
AGND2 10 11 DGND
SSOP, θJA Thermal Impedance . 126°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . 215°C Infrared (15 sec) . 220°C TSSOP, θ
ORDERING GUIDE
JA Thermal Impedance . 143°C/W Lead Temperature, Soldering
Temperature Package
Vapor Phase (60 sec) . 215°C
Model Range Option1
Infrared (15 sec) . 220°C *Stresses above those listed under Absolute Maximum Ratings may cause perma- AD73311LAR –40°C to +105°C R-20 nent damage to the device. This is a stress rating only; functional operation of the AD73311LARS –40°C to +105°C RS-20 device at these or any other conditions above those listed in the operational sections AD73311LARU –40°C to +105°C RU-20 of this specification is not implied. Exposure to absolute maximum rating condi- EVAL-AD73311LEB Evaluation Board2 tions for extended periods may affect device reliability. NOTES 1R = 0.3' Small Outline IC (SOIC), RS = Shrink Small Outline Package (SSOP), RU = Thin Small Shrink Outline Package (TSSOP). 2The AD73311L evaluation board features a cascade of two codecs interfaced to an ADSP-2185L DSP. The board features a DSP software monitor which allows interface to a PC serial port.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
WARNING!
accumulate on the human body and test equipment and can discharge without detection. Although the AD73311L features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
ESD SENSITIVE DEVICE
precautions are recommended to avoid performance degradation or loss of functionality. –6– REV. A