Datasheet MIC4609 (Microchip) - 7

MIC4609 AC/DC ELECTRICAL CHARACTERISTICS (CONTINUED) (Note 1, 2) Electrical Specifications:
Unless otherwise indicated, VDD = VxHB = 20V, VEN = 5V, VSS = VxHS = 0V; No load on xLO or xHO, TA = +25°C.
Bold
values indicate –40°C TJ +125°C.
Parameter Symbol Min. Typ. Max. Units Conditions Overcurrent Protection
Rising Overcurrent Threshold VISNS+ 420 520 650 mV — ISNS Pin Blanking Time tISNS_BLK 270 370 470 ns — ISNS-to-Gate Propagation Delay tISNS_PROP 400 650 900 ns —
Fault Circuit
Fault Pin Output Low Voltage VOLF — —
0.8
V VISNS = 1V, IFAULT = 1 mA Rising VCIN Pin Threshold VRCIN+ — 5 — V — VCIN Hysteresis VRCIN_HYS — 0.6 — V — RCIN Pin Current Source IRCIN 3 5 7 µA VRCIN = 0V Fault Clear Time tFCL 0.5 1 2 ms CRCIN = 1nF
LO Gate Driver
Low-Level Output Voltage VxOLL — 0.5
0.9
V IxLO = 50 mA I High-Level Output Voltage V xLO = -50 mA xOHL — 0.6
0.9
V VxOHL = VDD – VxLO Peak Sink Current IxOHL — 1 — A VxLO = 0V Peak Source Current IxOLL — 1 — A VxLO = 20V
HO Gate Driver
Low-Level Output Voltage VxOLH — 0.5
0.9
V IxHO = 50 mA I High-Level Output Voltage V xHO = –50 mA xOHH — 0.6
0.9
V VxOHH = VxHB – VxHO Peak Sink Current IxOHH — 1 — A VxHO = 0V Peak Source Current IxOLH — 1 — A VxHO = 20V
Switching Specifications
Turn-On Propagation Delay tON 300 600 700 ns CL = 1 nF Turn-Off Propagation Delay tOFF 300 550 700 ns CL = 1 nF Turn-On Rise Time tR — 20 60 ns CL = 1 nF Turn-Off Fall Time tF — 20 60 ns CL = 1 nF Input Filtering Time tFLTR 200 300 480 ns xLI, xHI, EN Dead Time tD 200 300 450 ns CL = 1 nF Delay Matching tDLYM — 50 — ns CL = 1 nF EN-to-Gate Shutdown Delay tEN_OFF 450 650 750 ns CL = 1 nF t Output Pulse Width Matching t PW > 1 µs PWN — 50 — ns CL = 1 nF
Note 1:
Specification for packaged product only.
2:
The x in the suffix of a pin name designates any of the three phases, e.g., xHS refers to either AHS, BHS or CHS.
3:
Enable resistance is typical only and is not production tested.  2016-2019 Microchip Technology Inc. DS20005531C-page 7 Document Outline 600V 3-Phase MOSFET/IGBT Driver Features Typical Applications General Description Package Type Functional Block Diagram MIC4609 – Top Level Circuit Functional Block Diagram MIC4609 – Phase x Drive Circuit Typical Application Circuit MIC4609 – 300V, 3-Phase Motor Driver 1.0 Electrical Characteristics Absolute Maximum Ratings Operating Ratings AC/DC Electrical Characteristics Temperature Characteristics 2.0 Typical Performance Curves FIGURE 2-1: VDD Quiescent Current vs. VDD Voltage. FIGURE 2-2: VDD Quiescent Current vs. Temperature. FIGURE 2-3: VHB Quiescent Current vs. VHB Voltage. FIGURE 2-4: VHB Quiescent Current vs. Temperature. FIGURE 2-5: VDD+HB Shutdown Current vs. Voltage. FIGURE 2-6: VDD+HB Shutdown Current vs. Temperature. FIGURE 2-7: VDD+HB Shutdown Current vs. Voltage. FIGURE 2-8: VDD+HB Shutdown Current vs. Temperature. FIGURE 2-9: VDD Operating Current vs. Frequency. FIGURE 2-10: VHB Operating Current vs. Frequency – One Phase. FIGURE 2-11: HO Output Sink ON-Resistance vs. VDD. FIGURE 2-12: HO Output Sink ON-Resistance vs. Temperature. FIGURE 2-13: LO Output Sink ON-Resistance vs. VDD. FIGURE 2-14: LO Output Sink ON-Resistance vs. Temperature. FIGURE 2-15: HO Output Source ON-Resistance vs. VDD. FIGURE 2-16: HO Output Source ON-Resistance vs. Temperature. FIGURE 2-17: LO Output Source ON-Resistance vs. VDD. FIGURE 2-18: LO Output Source ON-Resistance vs. Temperature. FIGURE 2-19: VDD/VHB ULVO vs. Temperature. FIGURE 2-20: Propagation Delay vs. VDD Voltage. FIGURE 2-21: Propagation Delay vs. Temperature. FIGURE 2-22: HO Rise Time vs. VDD Voltage. FIGURE 2-23: HO Fall Time vs. VDD Voltage. FIGURE 2-24: LO Rise Time vs. VDD Voltage. FIGURE 2-25: LO Fall Time vs. VDD Voltage. FIGURE 2-26: Rise/Fall Time vs. Temperature (VDD = 10V). FIGURE 2-27: Rise/Fall Time vs. Temperature (VDD = 20V). FIGURE 2-28: Dead Time vs. VDD Voltage. FIGURE 2-29: Dead Time vs. Temperature (VDD = 10V). FIGURE 2-30: Dead Time vs. Temperature (VDD = 20V). FIGURE 2-31: Overcurrent Threshold vs. VDD Voltage. FIGURE 2-32: Overcurrent Threshold vs. Temperature. FIGURE 2-33: Overcurrent Propagation Delay vs. VDD Voltage. FIGURE 2-34: Overcurrent Propagation Delay vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Functional Description 4.1 UVLO Protection 4.2 Startup and UVLO FIGURE 4-1: Startup and Fault Timing Diagram. TABLE 4-1: Operational Truth Table 4.3 Enable Inputs 4.4 Input Stage FIGURE 4-2: Input Stage Block Diagram. FIGURE 4-3: Minimum Pulse-Width Diagram. 4.5 Dead Time and Anti-Shoot-Through Protection FIGURE 4-4: Dead Time, Propagation Delay, and Rise/Fall-Time Diagram. 4.6 Low-Side Driver Output Stage FIGURE 4-5: Low-Side Driver Block Diagram. 4.7 High-Side Driver and Bootstrap Circuit FIGURE 4-6: High-Side Driver and Bootstrap Circuit Block Diagram. FIGURE 4-7: MIC4609 Motor Driver Typical Application – Phase A. 4.8 Overcurrent Protection Circuitry FIGURE 4-8: Overcurrent Fault Sequence. 5.0 Application Information 5.1 Bootstrap Circuit FIGURE 5-1: MIC4609 – Bootstrap Circuit. 5.2 HS Node Clamp FIGURE 5-2: Negative HS Pin Voltage. 5.3 Power Dissipation Considerations FIGURE 5-3: MIC4609 High-Side Driving an External IGBT. FIGURE 5-4: Typical Gate Charge vs. VGE. 5.4 Decoupling Capacitor Selection 5.5 Grounding, Component Placement, and Circuit Layout FIGURE 5-5: Turn-On Current Paths. FIGURE 5-6: Turn-Off Current Paths. 6.0 Packaging Information 6.1 Package Marking Information 28-Lead SOICW Package Outline and Recommended Land Pattern Appendix A: Revision History Revision C (September 2019) Revision B (November 2017) Revision A (March 2016) Product Identification System Trademark Worldwide Sales and Service