Datasheet MIC4609 (Microchip) - 10

MIC4609 Note:
Unless otherwise indicated, TA = +25°C with 10V  VDD  20V.
120 200 ) HI = LI = 0V V = V HB DD V = GND HS 180 V = 0V HS (μA 100 EN = 0V A) C = 0 nF L V = V 25ºC 160 (μ DD HB -40ºC 125ºC 140 80 rent 120 25ºC Current n 60 100 ing Cur 80 at utdow 40 er 60 Sh -40ºC p O B 20 40 125ºC +H HB 20 DD V V 0 0 10 11 12 13 14 15 16 17 18 19 20 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 V (V) DD+HB Frequency (kHz) FIGURE 2-7:
VDD+HB Shutdown Current
FIGURE 2-10:
VHB Operating Current vs. vs. Voltage. Frequency – One Phase.
120 25 I = 50 mA HO V = GND HS (μA) V = 20V 100 DD EN = V = V HB DD V = 15V DD 20 ) 125ºC 80 (
Ω
25ºC n Current 60 15 Sink ON 40 R Shutdow HI = LI = 0V 10 B 20 V = GND V = 10V HS DD EN = 0V DD+HV V = V -40ºC 0 DD HB 5 -50 -25 0 25 50 75 100 125 10 11 12 13 14 15 16 17 18 19 20 Temperature (°C) V (V) DD FIGURE 2-8:
VDD+HB Shutdown Current
FIGURE 2-11:
HO Output Sink vs. Temperature. ON-Resistance vs. VDD.
200 25 V = V I = 50 mA HO HB DD 180 A) V = 0V V = GND HS HS EN = V = V (μ 160 C = 0 nF HB DD L 125ºC 25ºC 20 140 ) V = 10V rent
Ω
DD 120 V = 15V DD 100 15 Sink ( ing Cur 80 at ON
-
40ºC er R 60 p O 10 40 DDV 20 V = 20V DD 0 5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 -50 -25 0 25 50 75 100 125 Frequency (kHz) Temperature (°C) FIGURE 2-9:
VDD Operating Current vs.
FIGURE 2-12:
HO Output Sink Frequency. ON-Resistance vs. Temperature. DS20005531C-page 10  2016-2019 Microchip Technology Inc. Document Outline 600V 3-Phase MOSFET/IGBT Driver Features Typical Applications General Description Package Type Functional Block Diagram MIC4609 – Top Level Circuit Functional Block Diagram MIC4609 – Phase x Drive Circuit Typical Application Circuit MIC4609 – 300V, 3-Phase Motor Driver 1.0 Electrical Characteristics Absolute Maximum Ratings Operating Ratings AC/DC Electrical Characteristics Temperature Characteristics 2.0 Typical Performance Curves FIGURE 2-1: VDD Quiescent Current vs. VDD Voltage. FIGURE 2-2: VDD Quiescent Current vs. Temperature. FIGURE 2-3: VHB Quiescent Current vs. VHB Voltage. FIGURE 2-4: VHB Quiescent Current vs. Temperature. FIGURE 2-5: VDD+HB Shutdown Current vs. Voltage. FIGURE 2-6: VDD+HB Shutdown Current vs. Temperature. FIGURE 2-7: VDD+HB Shutdown Current vs. Voltage. FIGURE 2-8: VDD+HB Shutdown Current vs. Temperature. FIGURE 2-9: VDD Operating Current vs. Frequency. FIGURE 2-10: VHB Operating Current vs. Frequency – One Phase. FIGURE 2-11: HO Output Sink ON-Resistance vs. VDD. FIGURE 2-12: HO Output Sink ON-Resistance vs. Temperature. FIGURE 2-13: LO Output Sink ON-Resistance vs. VDD. FIGURE 2-14: LO Output Sink ON-Resistance vs. Temperature. FIGURE 2-15: HO Output Source ON-Resistance vs. VDD. FIGURE 2-16: HO Output Source ON-Resistance vs. Temperature. FIGURE 2-17: LO Output Source ON-Resistance vs. VDD. FIGURE 2-18: LO Output Source ON-Resistance vs. Temperature. FIGURE 2-19: VDD/VHB ULVO vs. Temperature. FIGURE 2-20: Propagation Delay vs. VDD Voltage. FIGURE 2-21: Propagation Delay vs. Temperature. FIGURE 2-22: HO Rise Time vs. VDD Voltage. FIGURE 2-23: HO Fall Time vs. VDD Voltage. FIGURE 2-24: LO Rise Time vs. VDD Voltage. FIGURE 2-25: LO Fall Time vs. VDD Voltage. FIGURE 2-26: Rise/Fall Time vs. Temperature (VDD = 10V). FIGURE 2-27: Rise/Fall Time vs. Temperature (VDD = 20V). FIGURE 2-28: Dead Time vs. VDD Voltage. FIGURE 2-29: Dead Time vs. Temperature (VDD = 10V). FIGURE 2-30: Dead Time vs. Temperature (VDD = 20V). FIGURE 2-31: Overcurrent Threshold vs. VDD Voltage. FIGURE 2-32: Overcurrent Threshold vs. Temperature. FIGURE 2-33: Overcurrent Propagation Delay vs. VDD Voltage. FIGURE 2-34: Overcurrent Propagation Delay vs. Temperature. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Functional Description 4.1 UVLO Protection 4.2 Startup and UVLO FIGURE 4-1: Startup and Fault Timing Diagram. TABLE 4-1: Operational Truth Table 4.3 Enable Inputs 4.4 Input Stage FIGURE 4-2: Input Stage Block Diagram. FIGURE 4-3: Minimum Pulse-Width Diagram. 4.5 Dead Time and Anti-Shoot-Through Protection FIGURE 4-4: Dead Time, Propagation Delay, and Rise/Fall-Time Diagram. 4.6 Low-Side Driver Output Stage FIGURE 4-5: Low-Side Driver Block Diagram. 4.7 High-Side Driver and Bootstrap Circuit FIGURE 4-6: High-Side Driver and Bootstrap Circuit Block Diagram. FIGURE 4-7: MIC4609 Motor Driver Typical Application – Phase A. 4.8 Overcurrent Protection Circuitry FIGURE 4-8: Overcurrent Fault Sequence. 5.0 Application Information 5.1 Bootstrap Circuit FIGURE 5-1: MIC4609 – Bootstrap Circuit. 5.2 HS Node Clamp FIGURE 5-2: Negative HS Pin Voltage. 5.3 Power Dissipation Considerations FIGURE 5-3: MIC4609 High-Side Driving an External IGBT. FIGURE 5-4: Typical Gate Charge vs. VGE. 5.4 Decoupling Capacitor Selection 5.5 Grounding, Component Placement, and Circuit Layout FIGURE 5-5: Turn-On Current Paths. FIGURE 5-6: Turn-Off Current Paths. 6.0 Packaging Information 6.1 Package Marking Information 28-Lead SOICW Package Outline and Recommended Land Pattern Appendix A: Revision History Revision C (September 2019) Revision B (November 2017) Revision A (March 2016) Product Identification System Trademark Worldwide Sales and Service