Datasheet BM83 (Microchip) - 10

BM83 Device Overview
The following table provides the features of the BM83 module.
Table 2-1. BM83 Module Features Features BM83SM1
SoC IS2083BM Pin Count 50 Dimension 32 mm x 15 mm
RF
PCB Antenna Yes Tx Power (typical) +11 dBm (Class1) and +1 dBm (Class2) RX Sensitivity -90 dBm (2 Mbps EDR) Bluetooth Power Class Class 1 and Class 2 RF Shield Yes
Audio
Audio DAC Output 2-channel DAC (Single-ended) SNR -95 dB DAC (Capless) SNR -95 dB ADC SNR -90 dB I2S Audio (Input/Output) with Master Clock (MCLK) Output Yes Analog Auxiliary In Yes Analog Microphone 2 Stereo Digital Microphone 1 External Audio Amp Interface Yes
Power
Battery Input (BAT_IN) 3.8V (typ.) DC Adapter Input (ADAP_IN) 5.0V (typ.) Integrated BUCK Regulator Yes Battery Charger (350 mA charging current max) Yes
Peripherals
UART (with HW flow control) Yes I2C Master Yes USB (full speed USB v1.1 interface) Yes SAR ADC 2 PWM 1 LED Driver 2 GPIOs 18 JTAG Debug Port (8051 MCU) 2-wire © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 10 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service