Datasheet BM83 (Microchip) - 3
| Hersteller | Microchip |
| Beschreibung | BM83 Bluetooth Stereo Audio Module |
| Seiten / Seite | 76 / 3 — BM83. Audio Codec. Peripherals. Operating Conditions. Compliance. … |
| Dateiformat / Größe | PDF / 4.9 Mb |
| Dokumentensprache | Englisch |
BM83. Audio Codec. Peripherals. Operating Conditions. Compliance. Applications. Datasheet
Modelllinie für dieses Datenblatt
Textversion des Dokuments
BM83
• Modified Sub-Band Coding (mSBC) Decoder for Wideband Speech • Packet Loss Concealment (PLC) for SBC and AAC Codecs Only
Audio Codec
• SBC and AAC • 20-bit Audio Stereo DAC with Signal-to-Noise Ratio (SNR) 95 dB • 16-bit Audio Stereo Analog-to-Digital Converter (ADC) with SNR 90 dB • 16-bit/24-bit I2S Digital Audio – 8 kHz, 16 kHz, 44.1 kHz, and 48 kHz sampling frequency for SBC and AAC
Peripherals
• Successive Approximation Register Analog-to-Digital Converter (SAR ADC) with Dedicated Channels: – Battery voltage detection and adapter voltage detection – Charger thermal protection and ambient temperature detection • UART (with hardware flow control) • USB (full-speed USB 1.1 interface) • Inter-Integrated Circuit (I2C™) Master • One Pulse Width Modulation (PWM) Channel • Two LED Drivers • Up to 18 General Purpose Inputs/Outputs (GPIOs) • 2-wire 8051 MCU Joint Test Action Group (JTAG) Debug
Operating Conditions
• Operating Voltage: 3.2V to 4.2V • Operating Temperature: –40°C to +85°C
Compliance
• Bluetooth Special Interest Group (SIG) QDID: 134083 (Class1) and 134099 (Class2) • Certified to the United States (FCC), Canada (ISED), Europe (CE), Korea (KCC), Taiwan (NCC), Japan (MIC),and China (SRRC) Radio Regulations. • RoHS Compliant
Applications
• Portable Speaker • Multiple Speakers • Headphones © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 3 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service
• Modified Sub-Band Coding (mSBC) Decoder for Wideband Speech • Packet Loss Concealment (PLC) for SBC and AAC Codecs Only
Audio Codec
• SBC and AAC • 20-bit Audio Stereo DAC with Signal-to-Noise Ratio (SNR) 95 dB • 16-bit Audio Stereo Analog-to-Digital Converter (ADC) with SNR 90 dB • 16-bit/24-bit I2S Digital Audio – 8 kHz, 16 kHz, 44.1 kHz, and 48 kHz sampling frequency for SBC and AAC
Peripherals
• Successive Approximation Register Analog-to-Digital Converter (SAR ADC) with Dedicated Channels: – Battery voltage detection and adapter voltage detection – Charger thermal protection and ambient temperature detection • UART (with hardware flow control) • USB (full-speed USB 1.1 interface) • Inter-Integrated Circuit (I2C™) Master • One Pulse Width Modulation (PWM) Channel • Two LED Drivers • Up to 18 General Purpose Inputs/Outputs (GPIOs) • 2-wire 8051 MCU Joint Test Action Group (JTAG) Debug
Operating Conditions
• Operating Voltage: 3.2V to 4.2V • Operating Temperature: –40°C to +85°C
Compliance
• Bluetooth Special Interest Group (SIG) QDID: 134083 (Class1) and 134099 (Class2) • Certified to the United States (FCC), Canada (ISED), Europe (CE), Korea (KCC), Taiwan (NCC), Japan (MIC),and China (SRRC) Radio Regulations. • RoHS Compliant
Applications
• Portable Speaker • Multiple Speakers • Headphones © 2019 Microchip Technology Inc.
Datasheet
DS70005402B-page 3 Document Outline Introduction Features Table of Contents 1. Quick References 1.1. Reference Documentation 1.2. Design Packages 1.3. Acronyms/Abbreviations 2. Device Overview 2.1. BM83 Module Pin Diagram 2.2. BM83 Module Pin Description 3. Audio Subsystem 3.1. Digital Signal Processor 3.2. Codec 3.2.1. DAC Performance 3.2.2. ADC Performance 3.3. Auxiliary Port 3.4. Analog Speaker Output 3.5. Microphone Inputs 4. Bluetooth Transceiver 4.1. Transmitter 4.2. Receiver 4.3. Synthesizer 4.4. Modulator-Demodulator 4.5. Adaptive Frequency Hopping 5. Power Management Unit 5.1. Power Supply 5.2. SAR ADC 5.3. LED Drivers 6. Application Information 6.1. Power On/Off Sequence 6.2. Reset 6.3. Configuring and Programming 6.3.1. Test Mode 6.3.2. 2-wire JTAG Program and Debug 6.3.2.1. Serial Program Clock (TCK_CPU) 6.3.2.2. Serial Program Data (TDI_CPU) 6.4. General Purpose I/O Pins 6.5. I2S Interface 6.6. Host MCU Interface Over UART 7. PCB Antenna Information 7.1. Antenna Radiation Pattern 7.2. Module Placement Guidelines 8. Physical Dimensions 9. Electrical Specifications 9.1. Timing Specifications 10. Soldering Recommendations 11. Ordering Information 12. Appendix A: Regulatory Approval 12.1. United States 12.1.1. Labeling and User Information Requirements 12.1.2. RF Exposure 12.1.3. Helpful Web Sites 12.2. Canada 12.2.1. Labeling and User Information Requirements 12.2.2. RF Exposure 12.2.3. Helpful Web Sites 12.3. Europe 12.3.1. Labeling and User Information Requirements 12.3.2. Conformity Assessment 12.3.2.1. Simplified EU Declaration of Conformity 12.3.3. Helpful Websites 12.4. Japan 12.4.1. Labeling and User Information Requirements 12.4.2. Helpful Web Sites 12.5. Korea 12.5.1. Labeling and User Information Requirements 12.5.2. Helpful Websites 12.6. Taiwan 12.6.1. Labeling and User Information Requirements 12.6.2. Helpful Web Sites 12.7. China 12.7.1. Labeling and User Information Requirements 12.8. Other Regulatory Information 13. Document Revision History The Microchip Website Product Change Notification Service Customer Support Microchip Devices Code Protection Feature Legal Notice Trademarks Quality Management System Worldwide Sales and Service