Datasheet LTC3315A (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Dual 5V, 2A Synchronous Step-Down DC/DCs in 2mm × 2mm LQFN |
| Seiten / Seite | 22 / 2 — ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. … |
| Dateiformat / Größe | PDF / 1.6 Mb |
| Dokumentensprache | Englisch |
ABSOLUTE MAXIMUM RATINGS. PIN CONFIGURATION. (Note 1). ORDER INFORMATION. PART MARKING*. PACKAGE. MSL. TEMPERATURE RANGE. PART NUMBER
Textversion des Dokuments
LTC3315A
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V TOP VIEW IN ... –0.3V to 6V EN1, EN2 .. –0.3V to Lesser of (VIN + 0.3V) or 6V FB1, FB2 ... –0.3V to Lesser of (VIN + 0.3V) or 6V MODE/SYNC SW1 MODE/SYNC .. –0.3V to Lesser of (VIN + 0.3V) or 6V 12 11 PGOOD ... –0.3V to 6V EN1 1 10 VIN I FB1 2 9 GND PGOOD ..5mA 13 Operating Junction Temperature (Notes 2, 3): GND FB2 3 8 GND LTC3315AE .. –40°C to 125°C EN2 4 7 V 5 6 IN LTC3315AI ... –40°C to 125°C LTC3315AH .. –40°C to 150°C SW2 LTC3315AMP ... –55°C to 150°C PGOOD LQFN PACKAGE Storage Temperature Range .. –65°C to 150°C 12-LEAD (2mm × 2mm × 0.74mm) Maximum Reflow (Package Body) Temperature ...260°C TJMAX = 150°C, θJA = 51°C/W, θJCBOTTOM = 8.6°C/W, θJCTOP = 80°C/W, θJB = 12°C/W, ΨJT = 0.8°C/W, θ AND Ψ VALUES DETERMINED PER JESD51-7 ON A JEDEC 2S2P PC EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTC3315AEV#TRPBF LHFY –40°C to 125°C LTC3315AEV#TRMPBF LHFY –40°C to 125°C LTC3315AIV#TRPBF LHFY –40°C to 125°C LTC3315AIV#TRMPBF LHFY –40°C to 125°C Au (RoHS) e4 LQFN MSL 3 LTC3315AHV#TRPBF LHFY –40°C to 150°C LTC3315AHV#TRMPBF LHFY –40°C to 150°C LTC3315AMPV#TRPBF LHFY –55°C to 150°C LTC3315AMPV#TRMPBF LHFY –55°C to 150°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • Device temperature grade is indicated by a label on the shipping container. • LGA and BGA Package and Tray Drawings • TRM = 500 pieces. • Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the full operating junction temperature range, otherwise specifications are at TA = 25°C (Notes 2, 3). VIN = 3.3V unless otherwise specified. PARAMETER CONDITIONS MIN TYP MAX UNITS Input Supply
Operating Supply Voltage (VIN) l 2.25 5.5 V VIN Undervoltage Lockout VIN Rising l 2.05 2.15 2.25 V VIN Undervoltage Lockout Hysteresis 150 mV VIN Quiescent Current in Shutdown 1.2 2 µA Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts
ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Note 1)
V TOP VIEW IN ... –0.3V to 6V EN1, EN2 .. –0.3V to Lesser of (VIN + 0.3V) or 6V FB1, FB2 ... –0.3V to Lesser of (VIN + 0.3V) or 6V MODE/SYNC SW1 MODE/SYNC .. –0.3V to Lesser of (VIN + 0.3V) or 6V 12 11 PGOOD ... –0.3V to 6V EN1 1 10 VIN I FB1 2 9 GND PGOOD ..5mA 13 Operating Junction Temperature (Notes 2, 3): GND FB2 3 8 GND LTC3315AE .. –40°C to 125°C EN2 4 7 V 5 6 IN LTC3315AI ... –40°C to 125°C LTC3315AH .. –40°C to 150°C SW2 LTC3315AMP ... –55°C to 150°C PGOOD LQFN PACKAGE Storage Temperature Range .. –65°C to 150°C 12-LEAD (2mm × 2mm × 0.74mm) Maximum Reflow (Package Body) Temperature ...260°C TJMAX = 150°C, θJA = 51°C/W, θJCBOTTOM = 8.6°C/W, θJCTOP = 80°C/W, θJB = 12°C/W, ΨJT = 0.8°C/W, θ AND Ψ VALUES DETERMINED PER JESD51-7 ON A JEDEC 2S2P PC EXPOSED PAD (PIN 13) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION PART MARKING* PACKAGE MSL TEMPERATURE RANGE PART NUMBER PAD FINISH DEVICE FINISH CODE TYPE RATING (SEE NOTE 2)
LTC3315AEV#TRPBF LHFY –40°C to 125°C LTC3315AEV#TRMPBF LHFY –40°C to 125°C LTC3315AIV#TRPBF LHFY –40°C to 125°C LTC3315AIV#TRMPBF LHFY –40°C to 125°C Au (RoHS) e4 LQFN MSL 3 LTC3315AHV#TRPBF LHFY –40°C to 150°C LTC3315AHV#TRMPBF LHFY –40°C to 150°C LTC3315AMPV#TRPBF LHFY –55°C to 150°C LTC3315AMPV#TRMPBF LHFY –55°C to 150°C • Contact the factory for parts specified with wider operating temperature • Recommended LGA and BGA PCB Assembly and Manufacturing ranges. *Pad or ball finish code is per IPC/JEDEC J-STD-609. Procedures • Device temperature grade is indicated by a label on the shipping container. • LGA and BGA Package and Tray Drawings • TRM = 500 pieces. • Tape and reel specifications. Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
ELECTRICAL CHARACTERISTICS The
l
denotes the specifications which apply over the full operating junction temperature range, otherwise specifications are at TA = 25°C (Notes 2, 3). VIN = 3.3V unless otherwise specified. PARAMETER CONDITIONS MIN TYP MAX UNITS Input Supply
Operating Supply Voltage (VIN) l 2.25 5.5 V VIN Undervoltage Lockout VIN Rising l 2.05 2.15 2.25 V VIN Undervoltage Lockout Hysteresis 150 mV VIN Quiescent Current in Shutdown 1.2 2 µA Rev. 0 2 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts