Datasheet LTC3315A (Analog Devices) - 4
| Hersteller | Analog Devices |
| Beschreibung | Dual 5V, 2A Synchronous Step-Down DC/DCs in 2mm × 2mm LQFN |
| Seiten / Seite | 22 / 4 — ELECTRICAL CHARACTERISTICS. Note 3:. Note 4:. Note 5:. Note 6: |
| Dateiformat / Größe | PDF / 1.6 Mb |
| Dokumentensprache | Englisch |
ELECTRICAL CHARACTERISTICS. Note 3:. Note 4:. Note 5:. Note 6:
Textversion des Dokuments
LTC3315A
ELECTRICAL CHARACTERISTICS
lifetime is derated for junction temperatures greater than 125°C. Note that
Note 3:
The LTC3315A includes overtemperature protection which the maximum ambient temperature consistent with these specifications protects the device during momentary overload conditions. Junction is determined by specific operating conditions in conjunction with board temperatures will exceed 150°C when overtemperature protection is layout, the rated package thermal impedance, and other environmental active. Continuous operation above the specified maximum operating factors. The junction temperature (TJ in °C) is calculated from ambient junction temperature may impair device reliability. temperature (TA in °C) and power dissipation (PD in Watts) according to
Note 4:
Static current, switches not switching. Actual current will be the formula: higher due to gate charge losses at the switching frequency. TJ = TA + (PD • θJA)
Note 5:
Overtemperature shutdown is not tested in production. where θJA (in °C/W) is the package thermal impedance. See High Temperature Considerations section for more details.
Note 6:
The soft-start time is the time from the start of switching until the FB pin reaches 475mV.
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = 3.3V, unless otherwise noted. VFB vs Temperature PMOS RDS(ON) vs Temperature NMOS RDS(ON) vs Temperature
510 150 50 V V 508 IN = 2.25V IN = 2.25V V 45 IN = 3.3V VIN = 3.3V 125 506 VIN = 5.5V V 40 IN = 5.5V 504 35 100 502 30 (mΩ) (mΩ) (mV) 500 75 25 V FB 498 R DS(ON) 20 R DS(ON) 50 496 15 494 10 25 492 5 490 0 0 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C) 3315 G01 3315ab G02 3315ab G03
NMOS, PMOS Leakage vs Oscillator Frequency vs Temperature Temperature Oscillator Frequency vs VIN
3.2 2.20 2.20 NMOS, VIN = 5.5V, SW = 5.5V VIN = 5.5V 2.8 NMOS, V 2.16 2.16 IN = 3.3V, SW = 3.3V VIN = 3.3V PMOS, VIN = 5.5V, SW = 0V V 2.12 IN = 2.25V 2.12 2.4 PMOS, VIN = 3.3V, SW = 0V 2.08 2.08 2.0 2.04 2.04 1.6 2.00 2.00 1.96 1.96 LEAKAGE (µA) 1.2 FREQUENCY (MHz) 1.92 FREQUENCY (MHz) 1.92 0.8 1.88 1.88 0.4 1.84 1.84 0 1.80 1.80 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 2 2.5 3 3.5 4 4.5 5 5.5 TEMPERATURE (°C) TEMPERATURE (°C) VIN (V) 3315ab G04 3315aba G05 3315ab G06 Rev. 0 4 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts
ELECTRICAL CHARACTERISTICS
lifetime is derated for junction temperatures greater than 125°C. Note that
Note 3:
The LTC3315A includes overtemperature protection which the maximum ambient temperature consistent with these specifications protects the device during momentary overload conditions. Junction is determined by specific operating conditions in conjunction with board temperatures will exceed 150°C when overtemperature protection is layout, the rated package thermal impedance, and other environmental active. Continuous operation above the specified maximum operating factors. The junction temperature (TJ in °C) is calculated from ambient junction temperature may impair device reliability. temperature (TA in °C) and power dissipation (PD in Watts) according to
Note 4:
Static current, switches not switching. Actual current will be the formula: higher due to gate charge losses at the switching frequency. TJ = TA + (PD • θJA)
Note 5:
Overtemperature shutdown is not tested in production. where θJA (in °C/W) is the package thermal impedance. See High Temperature Considerations section for more details.
Note 6:
The soft-start time is the time from the start of switching until the FB pin reaches 475mV.
TYPICAL PERFORMANCE CHARACTERISTICS TA = 25°C, VIN = 3.3V, unless otherwise noted. VFB vs Temperature PMOS RDS(ON) vs Temperature NMOS RDS(ON) vs Temperature
510 150 50 V V 508 IN = 2.25V IN = 2.25V V 45 IN = 3.3V VIN = 3.3V 125 506 VIN = 5.5V V 40 IN = 5.5V 504 35 100 502 30 (mΩ) (mΩ) (mV) 500 75 25 V FB 498 R DS(ON) 20 R DS(ON) 50 496 15 494 10 25 492 5 490 0 0 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C) 3315 G01 3315ab G02 3315ab G03
NMOS, PMOS Leakage vs Oscillator Frequency vs Temperature Temperature Oscillator Frequency vs VIN
3.2 2.20 2.20 NMOS, VIN = 5.5V, SW = 5.5V VIN = 5.5V 2.8 NMOS, V 2.16 2.16 IN = 3.3V, SW = 3.3V VIN = 3.3V PMOS, VIN = 5.5V, SW = 0V V 2.12 IN = 2.25V 2.12 2.4 PMOS, VIN = 3.3V, SW = 0V 2.08 2.08 2.0 2.04 2.04 1.6 2.00 2.00 1.96 1.96 LEAKAGE (µA) 1.2 FREQUENCY (MHz) 1.92 FREQUENCY (MHz) 1.92 0.8 1.88 1.88 0.4 1.84 1.84 0 1.80 1.80 –50 –25 0 25 50 75 100 125 150 –50 –25 0 25 50 75 100 125 150 2 2.5 3 3.5 4 4.5 5 5.5 TEMPERATURE (°C) TEMPERATURE (°C) VIN (V) 3315ab G04 3315aba G05 3315ab G06 Rev. 0 4 For more information www.analog.com Document Outline Features Applications Typical Application Description Absolute Maximum Ratings Order Information Electrical Characteristics Pin Configuration Typical Performance Characteristics Pin Functions Block Diagram Operation Applications Information Typical Applications Package Description Typical Application Related Parts