MAAM-011275-DIEWideband Distributed Amplifier30 kHz - 40 GHzRev. V1Application Schematic C3 VDD DETREF DETOUT VDD C1 DETBIAS DETREF DETOUT VDAUX VDD GND GND RFOUT RFOUT VG2 /VDD VG2 GND External GND Bias Tee RF GND IN Backside Die RFIN GND GND VG1 DC Block GND VG1 C2 C4 Al bond pads labelled GND have vias to the backside metal. Bond wires on these pads are optional. Component ListPartValueSize C1 100 pF Single Layer C2 1000 pF 0402 C3, C4 1 µF 0402 4 MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support DC-0018857