Datasheet AD810-EP (Analog Devices) - 5
| Hersteller | Analog Devices |
| Beschreibung | Low Power Video Op Amp with Disable |
| Seiten / Seite | 8 / 5 — Enhanced Product. AD810-EP. ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM … |
| Dateiformat / Größe | PDF / 163 Kb |
| Dokumentensprache | Englisch |
Enhanced Product. AD810-EP. ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION. Parameter. Rating. 1.6. 1.4. 1.2. TION A. 1.0. IP S
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Enhanced Product AD810-EP ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION Parameter Rating
The maximum power that can be safely dissipated by the AD810 is Supply Voltage ±18 V limited by the associated rise in junction temperature. To ensure Internal Power Dissipation See Figure 2 proper operation, it is important to observe the derating curves Output Short-Circuit Duration1 See Figure 2 in Figure 2. Common-Mode Input Voltage ±VS
1.6
Differential Input Voltage ±6 V
1.4
Storage Temperature Range −65°C to +150°C
W)
Operating Temperature Range −55°C to +125°C
( 1.2
Junction Temperature 145°C
TION A 1.0
Lead Temperature Range (Soldering 300°C
IP S
60 sec)
IS 0.8 D R
1 Internal short-circuit protection may not be sufficient to guarantee that the
0.6 OWE
maximum junction temperature is not exceeded under all conditions.
L P 0.4
Stresses at or above those listed under Absolute Maximum
TOTA
Ratings may cause permanent damage to the product. This is a
0.2
stress rating only; functional operation of the product at these
0
or any other conditions above those indicated in the operational
–55 –35 –15 5 25 45 65 85 105 125
002 section of this specification is not implied. Operation beyond
AMBIENT TEMPERATURE (°C)
20396- the maximum operating conditions for extended periods may Figure 2. Total Power Dissipation vs. Ambient Temperature affect product reliability.
ESD CAUTION THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one-cubic foot sealed enclosure.
Table 3. Thermal Resistance Package Type θJA Unit
R-8 150 °C/W Rev. 0 | Page 5 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE
Enhanced Product AD810-EP ABSOLUTE MAXIMUM RATINGS Table 2. MAXIMUM POWER DISSIPATION Parameter Rating
The maximum power that can be safely dissipated by the AD810 is Supply Voltage ±18 V limited by the associated rise in junction temperature. To ensure Internal Power Dissipation See Figure 2 proper operation, it is important to observe the derating curves Output Short-Circuit Duration1 See Figure 2 in Figure 2. Common-Mode Input Voltage ±VS
1.6
Differential Input Voltage ±6 V
1.4
Storage Temperature Range −65°C to +150°C
W)
Operating Temperature Range −55°C to +125°C
( 1.2
Junction Temperature 145°C
TION A 1.0
Lead Temperature Range (Soldering 300°C
IP S
60 sec)
IS 0.8 D R
1 Internal short-circuit protection may not be sufficient to guarantee that the
0.6 OWE
maximum junction temperature is not exceeded under all conditions.
L P 0.4
Stresses at or above those listed under Absolute Maximum
TOTA
Ratings may cause permanent damage to the product. This is a
0.2
stress rating only; functional operation of the product at these
0
or any other conditions above those indicated in the operational
–55 –35 –15 5 25 45 65 85 105 125
002 section of this specification is not implied. Operation beyond
AMBIENT TEMPERATURE (°C)
20396- the maximum operating conditions for extended periods may Figure 2. Total Power Dissipation vs. Ambient Temperature affect product reliability.
ESD CAUTION THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required. θJA is the natural convection junction to ambient thermal resistance measured in a one-cubic foot sealed enclosure.
Table 3. Thermal Resistance Package Type θJA Unit
R-8 150 °C/W Rev. 0 | Page 5 of 8 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS CONNECTION DIAGRAM GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE MAXIMUM POWER DISSIPATION ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE