Datasheet LT1175 (Analog Devices) - 16
| Hersteller | Analog Devices |
| Beschreibung | 500mA Negative Low Dropout Micropower Regulator |
| Seiten / Seite | 20 / 16 — PACKAGE DESCRIPTION. Q Package. 5-Lead Plastic DD Pak |
| Dateiformat / Größe | PDF / 221 Kb |
| Dokumentensprache | Englisch |
PACKAGE DESCRIPTION. Q Package. 5-Lead Plastic DD Pak
Modelllinie für dieses Datenblatt
- LT1175CN8#PBF LT1175CN8-5#PBF LT1175CQ#PBF LT1175CQ#TRPBF LT1175CQ-5#PBF LT1175CQ-5#TRPBF LT1175CS8#PBF LT1175CS8#TRPBF LT1175CS8-5#PBF LT1175CS8-5#TRPBF LT1175CST-5#PBF LT1175CST-5#TRPBF LT1175CT#06PBF LT1175CT#PBF LT1175CT-5#06PBF LT1175CT-5#PBF LT1175IN8#PBF LT1175IN8-5#PBF LT1175IQ#PBF LT1175IQ#TRPBF LT1175IQ-5#PBF LT1175IQ-5#TRPBF LT1175IS8#PBF LT1175IS8#TRPBF LT1175IS8-5#PBF LT1175IS8-5#TRPBF LT1175IST-5#PBF LT1175IST-5#TRPBF LT1175IT#PBF LT1175IT-5#PBF LT1175MPQ#PBF LT1175MPQ#TR LT1175MPQ#TRPBF LT1175MPQ-5 LT1175MPQ-5#PBF LT1175MPQ-5#TRPBF LT1175MPS8#PBF LT1175MPS8#TRPBF LT1175MPS8-5 LT1175MPS8-5#PBF LT1175MPS8-5#TRPBF
Textversion des Dokuments
LT1175
PACKAGE DESCRIPTION Q Package 5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461) .060 (1.524) .390 – .415 TYP (9.906 – 10.541) .060 .165 – .180 .256 (1.524) (6.502) (4.191 – 4.572) .045 – .055 (1.143 – 1.397) 15° TYP +.008 .004 .060 –.004 .183 .059 .330 – .370 (1.524) (4.648) (1.499) (8.382 – 9.398) TYP ( +0.203 0.102 –0.102) .095 – .115 (2.413 – 2.921) .075 (1.905) .067 .050 ± .012 .300 +.012 .013 – .023 .143 (1.702) (1.270 ± 0.305) (7.620) –.020 (0.330 – 0.584) .028 – .038 BSC +0.305 BOTTOM VIEW OF DD PAK 3.632 (0.711 – 0.965) HATCHED AREA IS SOLDER PLATED ( –0.508) Q(DD5) 0502 TYP COPPER HEAT SINK .420 .080 .420 .276 .350 .325 .205 .565 .565 .320 .090 .090 .067 .042 .067 .042 RECOMMENDED SOLDER PAD LAYOUT RECOMMENDED SOLDER PAD LAYOUT FOR THICKER SOLDER PASTE APPLICATIONS NOTE: 1. DIMENSIONS IN INCH/(MILLIMETER) 2. DRAWING NOT TO SCALE 1175ff 16
PACKAGE DESCRIPTION Q Package 5-Lead Plastic DD Pak
(Reference LTC DWG # 05-08-1461) .060 (1.524) .390 – .415 TYP (9.906 – 10.541) .060 .165 – .180 .256 (1.524) (6.502) (4.191 – 4.572) .045 – .055 (1.143 – 1.397) 15° TYP +.008 .004 .060 –.004 .183 .059 .330 – .370 (1.524) (4.648) (1.499) (8.382 – 9.398) TYP ( +0.203 0.102 –0.102) .095 – .115 (2.413 – 2.921) .075 (1.905) .067 .050 ± .012 .300 +.012 .013 – .023 .143 (1.702) (1.270 ± 0.305) (7.620) –.020 (0.330 – 0.584) .028 – .038 BSC +0.305 BOTTOM VIEW OF DD PAK 3.632 (0.711 – 0.965) HATCHED AREA IS SOLDER PLATED ( –0.508) Q(DD5) 0502 TYP COPPER HEAT SINK .420 .080 .420 .276 .350 .325 .205 .565 .565 .320 .090 .090 .067 .042 .067 .042 RECOMMENDED SOLDER PAD LAYOUT RECOMMENDED SOLDER PAD LAYOUT FOR THICKER SOLDER PASTE APPLICATIONS NOTE: 1. DIMENSIONS IN INCH/(MILLIMETER) 2. DRAWING NOT TO SCALE 1175ff 16