Datasheet ADP1876 (Analog Devices) - 7

Data Sheet ADP1876 ABSOLUTE MAXIMUM RATINGS Table 2.
Stresses at or above those listed under Absolute Maximum
Parameter Rating
Ratings may cause permanent damage to the product. This is a VIN, EN1/EN2, RAMP1/RAMP2 21 V stress rating only; functional operation of the product at these FB1/FB2, COMP1/COMP2, SS1/SS2, TRK1, −0.3 V to +6 V or any other conditions above those indicated in the operational VINLDO, VOUTLDO, VCCO, VDL, section of this specification is not implied. Operation beyond PGOOD1/PGOOD2 the maximum operating conditions for extended periods may ILIM1/ILIM2 −0.3 V to +21 V affect product reliability. BST1/BST2 to SW1/SW2 −0.3 V to +6 V Absolute maximum ratings apply individually only, not in BST1/BST2, DH1/DH2, SW1/SW2 to −0.3 V to +28 V PGND1/PGND2 combination. Unless otherwise specified, all other voltages are DL1/DL2 to PGND1/PGND2 −0.3 V to VCCO + 0.3 V referenced to GND. BST1/BST2 to PGND1/PGND2, SW1/SW2 to 32 V PGND1/PGND2 (20 ns Transients) SW1, SW2 to PGND1, PGND2 25 V
ESD CAUTION
(20 ns Transients) DL1/DL2, SW1/SW2, ILIM1/ILIM2 to −8 V PGND1/PGND2 (20 ns Negative Transients) PGND1/PGND2 to AGND −0.3 V to +0.3 V PGND1/PGND2 to AGND (20 ns Transients) −8 V to +4 V θJA, Multilayer PCB (Natural Convection)1, 2 32.6°C/W Operating Junction Temperature Range3 −40°C to +125°C Storage Temperature Range −65°C to +150°C Maximum Soldering Lead Temperature 260°C 1 Measured with exposed pad attached to the printed circuit board (PCB). 2 Junction-to-ambient thermal resistance (θJA) of the package was calculated or simulated on a multilayer PCB. 3 The junction temperature, TJ, of the device is dependent on the ambient temperature, TA, the power dissipation of the device, PD, and the junction to ambient thermal resistance of the package, θJA. Maximum junction temperature is calculated from the ambient temperature and power dissipation using the formula, TJ = TA + PD × θJA. Rev. B | Page 7 of 24 Document Outline FEATURES APPLICATIONS TYPICAL OPERATION CIRCUIT GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY FUNCTIONAL BLOCK DIAGRAM SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION INDEPENDENT LOW DROPOUT LINEAR REGULATOR CONTROLLER ARCHITECTURE Synchronous Rectifier and Dead Time INPUT UNDERVOLTAGE LOCKOUT INTERNAL LINEAR REGULATOR (VCCO) OVERVOLTAGE PROTECTION POWER GOOD SHORT-CIRCUIT AND CURRENT-LIMIT PROTECTION SHUTDOWN CONTROL THERMAL OVERLOAD PROTECTION APPLICATIONS INFORMATION INDEPENDENT LOW DROPOUT LINEAR REGULATOR SETTING THE OUTPUT VOLTAGE OF THE CONTROLLER SOFT START SETTING THE CURRENT LIMIT ACCURATE CURRENT-LIMIT SENSING SETTING THE SLOPE COMPENSATION SETTING THE CURRENT SENSE GAIN INPUT CAPACITOR SELECTION INPUT FILTER BOOST CAPACITOR SELECTION INDUCTOR SELECTION OUTPUT CAPACITOR SELECTION MOSFET SELECTION LOOP COMPENSATION SWITCHING NOISE AND OVERSHOOT REDUCTION PCB LAYOUT GUIDELINE TYPICAL APPLICATIONS CIRCUIT PACKAGING AND ORDERING INFORMATION OUTLINE DIMENSIONS ORDERING GUIDE