Datasheet ADR03-EP (Analog Devices) - 4

ADR03-EP Enhanced Product ABSOLUTE MAXIMUM RATINGS
Ratings are at 25°C, unless otherwise noted.
THERMAL RESISTANCE Table 2.
Thermal performance is directly linked to PCB design and
Parameter Rating
operating environment. Careful attention to PCB thermal Supply Voltage 15.0 V design is required. Output Short-Circuit Duration to GND Indefinite
Table 3. Thermal Resistance
Storage Temperature Range −65°C to +150°C
Package Type θJA θJC Unit
Operating Temperature Range −55°C to +125°C KS-51 266.4 203.7 °C/W Junction Temperature Range −65°C to +150°C Lead Temperature (Soldering, 60 sec) 260°C 1 Test Condition 1: Thermal impedance simulated values are based on JEDEC 2S2P thermal test board. See JEDEC JESD-51. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these
ESD CAUTION
or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 4 of 6 Document Outline FEATURES ENHANCED PRODUCT FEATURES APPLICATIONS PIN CONFIGURATION GENERAL DESCRIPTION TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS ELECTRICAL CHARACTERISTICS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE ESD CAUTION TYPICAL PERFORMANCE CHARACTERISTICS OUTLINE DIMENSIONS ORDERING GUIDE