Preliminary Datasheet ADAR1000 (Analog Devices) - 8

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ADAR1000 Preliminary Technical Data ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating
Stresses above those listed under Absolute Maximum Ratings AVDD1 to GND TBD may cause permanent damage to the device. This is a stress AVDD3 to GND TBD rating only; functional operation of the device at these or any AVDD2 to AVDD3 TBD other conditions above those indicated in the operational Digital I/O Voltage to GND TBD section of this specification is not implied. Exposure to absolute Operating Temperature Range −40°C to +85°C maximum rating conditions for extended periods may affect Storage Temperature Range −65°C to +150°C device reliability. Maximum Junction Temperature 150°C θJA Thermal Impedance1 (Paddle TBD Soldered)
ESD CAUTION
Reflow Soldering Peak Temperature TBD Time at Peak Temperature TBD Transistor Count CMOS TBD Bipolar TBD ESD Charged Device Model TBD Human Body Model TBD 1 Rev. PrF | Page 8 of 51 Document Outline Features Applications General Description Functional Block Diagram Specifications Timing Specifications Timing Diagram SPI Block Write Mode Absolute Maximum Ratings ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Changes from Previous Silicon Revision T/R switch driver output External PA and LNA bias DACs Eliminated the -3.3V supply input to the chip New PA_ON input pin Applications Gain Control Registers Switched Attenuator Control TR_SW_POS and TR_SW_NEG (T/R Switch Control) TX/RX Subcircuit Control TR_SOURCE = 0 SPI Programming Example Register Maps Address: 0x000, Reset: 0x00, Name: INTERFACE_CONFIG_A Outline Dimensions