Datasheet AD8028-KGD-CHIP (Analog Devices) - 8

AD8028-KGD-CHIP Known Good Die OUTLINE DIMENSIONS 1.415 10 1 9 1.205 2 8 3 7 4 5 6 A TOP VIEW (CIRCUIT SIDE) 2012- 0.076 × 0.076 23- 08-
Figure 2. 10-Pad Bare Die [CHIP] (C-10-3) Dimensions shown in millimeters
DIE SPECIFICATIONS AND ASSEMBLY RECOMMENDATIONS Table 6. Typical Die Specifications Parameter Value Unit
Chip Size 1420 × 1290 µm Scribe Line Width 75 µm Die Size 55.7 × 47.4 Mil Thickness 305 µm Bond Pads (Min Size) 76 × 76 µm Bond Pad Composition 1% Copper Doped Aluminum % Backside Si Not Applicable Passivation Doped oxide/SiN Not Applicable ESD HBM 2000 V
Table 7. Assembly Recommendations Assembly Component Recommendation
Die Attach Ablestik 84-1LMIS R4 Bonding Method 1 mil gold
ORDERING GUIDE Model Temperature Range Package Description Package Option
AD8028-KGD-CHIP –40°C to +125°C 10-Pad Bare Die C-10-3
©2012 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D10787-0-11/12(B)
Rev. B | Page 8 of 8 Document Outline Features Applications General Description Revision History Specifications Absolute Maximum Ratings ESD Caution Pad Configuration and Function Descriptions Outline Dimensions Die Specifications and Assembly Recommendations Ordering Guide