Datasheet ADXL362 (Analog Devices) - 8

HerstellerAnalog Devices
BeschreibungMicropower, 3-Axis, ±2 g/±4 g/±8 g Digital Output MEMS Accelerometer
Seiten / Seite45 / 8 — ADXL362. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. RECOMMENDED …
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ADXL362. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 2. RECOMMENDED SOLDERING PROFILE. Parameter. Rating. CRITICAL ZONE. TL TO TP

ADXL362 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2 RECOMMENDED SOLDERING PROFILE Parameter Rating CRITICAL ZONE TL TO TP

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ADXL362 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. RECOMMENDED SOLDERING PROFILE Parameter Rating
Figure 3 and Table 5 provide details about the recommended Acceleration (Any Axis, Unpowered) 5000 g soldering profile. Acceleration (Any Axis, Powered) 5000 g
CRITICAL ZONE
V
t
S −0.3 V to +3.6 V
P TL TO TP TP
VDD I/O −0.3 V to +3.6 V
RAMP-UP
All Other Pins −0.3 V to VS
E TL T tL
Output Short-Circuit Duration Indefinite
UR SMAX T
(Any Pin to Ground)
RA TSMIN
ESD 2000 V (HBM)
EMPE
Short Term Maximum Temperature
T tS PREHEAT RAMP-DOWN
Four Hours 150°C One Minute 260°C 003 Temperature Range (Powered) −50°C to +150°C
t25°C TO PEAK TIME
10776- Temperature Range (Storage) −50°C to +150°C Figure 3. Recommended Soldering Profile Stresses at or above those listed under Absolute Maximum
Table 5. Recommended Soldering Profile
Ratings may cause permanent damage to the product. This is a
Condition
stress rating only; functional operation of the product at these
Profile Feature Sn63/Pb37 Pb-Free
or any other conditions above those indicated in the operational Average Ramp Rate (TL to TP) 3°C/sec max 3°C/sec max section of this specification is not implied. Operation beyond Preheat the maximum operating conditions for extended periods may Minimum Temperature (TSMIN) 100°C 150°C affect product reliability. Maximum Temperature (TSMAX) 150°C 200°C Time (T
THERMAL RESISTANCE
SMIN to TSMAX)(tS) 60 sec to 120 sec 60 sec to 180 sec TSMAX to TL Ramp-Up Rate 3°C/sec max 3°C/sec max
Table 3. Package Characteristics
Time Maintained Above Liquidous (TL)
Package Type θJA θJC Device Weight
Liquidous Temperature (TL) 183°C 217°C 16-Terminal LGA 150°C/W 85°C/W 18 mg Time (tL) 60 sec to 150 sec 60 sec to 150 sec Peak Temperature (TP) 240 + 0/−5°C 260 + 0/−5°C
PACKAGE INFORMATION
Time Within 5°C of Actual 10 sec to 30 sec 20 sec to 40 sec Figure 2 and Table 4 provide details about the package branding Peak Temperature (tP) for the ADXL362. For a complete listing of product availability, Ramp-Down Rate 6°C/sec max 6°C/sec max Time 25°C to Peak 6 minutes max 8 minutes max see the Ordering Guide section. Temperature
• 3 6 2 B ESD CAUTION # y w w v v v v
002 10776- Figure 2. Product Information on Package (Top View)
Table 4. Package Branding Information Branding Key Field Description
●362B Pin 1 indicator and device identifier #yww Pb-free designator (#) and date code vvvv Factory lot code Rev. E | Page 6 of 43 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM REVISION HISTORY SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS THERMAL RESISTANCE PACKAGE INFORMATION RECOMMENDED SOLDERING PROFILE ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TYPICAL PERFORMANCE CHARACTERISTICS THEORY OF OPERATION MECHANICAL DEVICE OPERATION OPERATING MODES Measurement Mode Wake-Up Mode Standby SELECTABLE MEASUREMENT RANGES SELECTABLE OUTPUT DATA RATES Antialiasing POWER/NOISE TRADEOFF POWER SAVINGS FEATURES ULTRALOW POWER CONSUMPTION IN ALL MODES MOTION DETECTION Activity Detection Referenced and Absolute Configurations Fewer False Positives Inactivity Detection Linking Activity and Inactivity Detection Default Mode Linked Mode Loop Mode Autosleep Using the AWAKE Bit FIFO System Level Power Savings Data Recording/Event Context COMMUNICATIONS SPI Instructions Bus Keepers MSB Registers ADDITIONAL FEATURES FREE FALL DETECTION EXTERNAL CLOCK SYNCHRONIZED DATA SAMPLING SELF TEST USER REGISTER PROTECTION TEMPERATURE SENSOR SERIAL COMMUNICATIONS SPI COMMANDS Read and Write Register Commands Read FIFO Command MULTIBYTE TRANSFERS Register Read/Write Auto-Increment INVALID ADDRESSES AND ADDRESS FOLDING LATENCY RESTRICTIONS INVALID COMMANDS REGISTER MAP REGISTER DETAILS DEVICE ID REGISTER DEVICE ID: 0x1D REGISTER PART ID: 0xF2 REGISTER SILICON REVISION ID REGISTER X-AXIS DATA (8 MSB) REGISTER Y-AXIS DATA (8 MSB) REGISTER Z-AXIS DATA (8 MSB) REGISTER STATUS REGISTER FIFO ENTRIES REGISTERS X-AXIS DATA REGISTERS Y-AXIS DATA REGISTERS Z-AXIS DATA REGISTERS TEMPERATURE DATA REGISTERS SOFT RESET REGISTER ACTIVITY THRESHOLD REGISTERS ACTIVITY TIME REGISTER INACTIVITY THRESHOLD REGISTERS INACTIVITY TIME REGISTERS ACTIVITY/INACTIVITY CONTROL REGISTER FIFO CONTROL REGISTER FIFO SAMPLES REGISTER INT1/INT2 FUNCTION MAP REGISTERS FILTER CONTROL REGISTER POWER CONTROL REGISTER SELF TEST REGISTER APPLICATIONS INFORMATION APPLICATION EXAMPLES Device Configuration Autonomous Motion Switch Start-up Routine Using External Timing Triggers Example: Implementing Free Fall Detection Start-up Routine POWER Power Supply Decoupling Power Supply Requirements FIFO MODES FIFO Disabled Oldest Saved Mode Stream Mode Triggered Mode FIFO Configuration FIFO Interrupts Retrieving Data from FIFO INTERRUPTS Interrupt Pins Alternate Functions of Interrupt Pins Activity and Inactivity Interrupts Data Ready Interrupt Using FIFO Interrupts FIFO Watermark FIFO Ready Overrun USING SYNCHRONIZED DATA SAMPLING USING AN EXTERNAL CLOCK USING SELF TEST OPERATION AT VOLTAGES OTHER THAN 2.0 V MECHANICAL CONSIDERATIONS FOR MOUNTING AXES OF ACCELERATION SENSITIVITY LAYOUT AND DESIGN RECOMMENDATIONS OUTLINE DIMENSIONS ORDERING GUIDE