AD7470/AD7472ABSOLUTE MAXIMUM RATINGS1 Junction Temperature . 150°C (TA = 25°C unless otherwise noted.) θJA Thermal Impedance . 75°C/W (SOIC) AV . 115°C/W (TSSOP) DD to AGND/DGND . –0.3 V to +7 V DV θ DD to AGND/DGND . –0.3 V to +7 V JC Thermal Impedance . 25°C/W (SOIC) V . 35°C/W (TSSOP) DRIVE to AGND/DGND . –0.3 V to +7 V AV Lead Temperature, Soldering DD to DVDD . –0.3 V to +0.3 V V Vapor Phase (60 sec) . 215°C DRIVE to DVDD . –0.3 V to DVDD + 0.3 V AGND to DGND . –0.3 V to +0.3 V Infrared (15 sec) . 220°C Analog Input Voltage to AGND . –0.3 V to AV ESD . 1.5 kV DD + 0.3 V Digital Input Voltage to DGND . –0.3 V to DVDD + 0.3 V NOTES REF IN to AGND . –0.3 V to AV 1Stresses above those listed under Absolute Maximum Ratings may cause perma- DD + 0.3 V Input Current to Any Pin Except Supplies2 . ± 10 mA nent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational Operating Temperature Range sections of this specification is not implied. Exposure to absolute maximum rating Commercial (A and B Versions) . –40°C to +85°C conditions for extended periods may affect device reliability. Industrial (Y Version) . –40°C to +125°C 2Transient currents of up to 100 mA will not cause SCR latch-up. Storage Temperature Range . –65°C to +150°C ORDERING GUIDETemperatureResolutionPackagePackageModelRange(Bits)Options1Description AD7470ARU –40°C to +85°C 10 RU-24 TSSOP AD7470ARU-REEL –40°C to +85°C 10 RU-24 TSSOP AD7470ARU-REEL7 –40°C to +85°C 10 RU-24 TSSOP AD7472AR –40°C to +85°C 12 R-24 SOIC AD7472AR-REEL –40°C to +85°C 12 R-24 SOIC AD7472AR-REEL7 –40°C to +85°C 12 R-24 SOIC AD7472ARU –40°C to +85°C 12 RU-24 TSSOP AD7472ARU-REEL –40°C to +85°C 12 RU-24 TSSOP AD7472ARU-REEL7 –40°C to +85°C 12 RU-24 TSSOP AD7472BR –40°C to +85°C 12 R-24 SOIC AD7472BR-REEL –40°C to +85°C 12 R-24 SOIC AD7472BRU –40°C to +85°C 12 RU-24 TSSOP AD7472BRU-REEL –40°C to +85°C 12 RU-24 TSSOP AD7472BRU-REEL7 –40°C to +85°C 12 RU-24 TSSOP AD7472YR –40°C to +125°C 12 R-24 SOIC AD7472YR-REEL –40°C to +125°C 12 R-24 SOIC AD7472YRU –40°C to +125°C 12 RU-24 TSSOP AD7472YRU-REEL –40°C to +125°C 12 RU-24 TSSOP AD7472YRU-REEL7 –40°C to +125°C 12 RU-24 TSSOP EVAL-AD7470CB2 Evaluation Board EVAL-AD7472CB2 Evaluation Board EVAL CONTROL BRD23 Controller Board NOTES 1R = SOIC; RU = TSSOP. 2This can be used as a standalone evaluation board or in conjunction with the EVAL-CONTROL BOARD for evaluation/demonstration purposes. 3This board is a complete unit allowing a PC to control and communicate with all Analog Devices evaluation boards ending in the CB designators. To order a complete evaluation kit, you need to order the specific ADC evaluation board, for example, EVAL-AD7472CB, the EVAL CONTROL BRD2, and a 12 V ac transformer. See the relevant evaluation board application note for more information. CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the AD7470/AD7472 features proprietary ESD protection circuitry, permanent dam- age may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. –6– REV. B Document Outline FEATURES FUNCTIONAL BLOCK DIAGRAM GENERAL DESCRIPTION PRODUCT HIGHLIGHTS SPECIFICATIONS TIMING SPECIFICATIONS ABSOLUTE MAXIMUM RATINGS ORDERING GUIDE PIN CONFIGURATIONS PIN FUNCTION DESCRIPTIONS TERMINOLOGY Integral Nonlinearity Differential Nonlinearity Offset Error Gain Error Track-and-Hold Acquisition Time Signal to (Noise + Distortion) Ratio Total Harmonic Distortion (THD) Peak Harmonic or Spurious Noise Intermodulation Distortion Aperture Delay Aperture Jitter CIRCUIT DESCRIPTION CONVERTER OPERATION TYPICAL CONNECTION DIAGRAM ADC TRANSFER FUNCTION AC ACQUISITION TIME Reference Input DC ACQUISITION TIME ANALOG INPUT CLOCK SOURCES PARALLEL INTERFACE OPERATING MODES Mode 1 (High Speed Sampling) Mode 2 (Sleep Mode) Burst Mode VDRIVE POWER-UP Power vs. Throughput Mode 1 Mode 2 Typical Performance Characteristics GROUNDING AND LAYOUT POWER SUPPLIES MICROPROCESSOR INTERFACING AD7470/AD7472 to ADSP-2185 Interface AD7470/AD7472 to ADSP-21065 Interface AD7470/AD7472 to TMS320C25 Interface AD7470/AD7472 to PIC17C4x Interface AD7470/AD7472 to 80C186 Interface OUTLINE DIMENSIONS Revision History