Datasheet AD7829-1 (Analog Devices) - 7
| Hersteller | Analog Devices |
| Beschreibung | 3 V/5 V, 2 MSPS, 8-Bit, 8-Channel ADC |
| Seiten / Seite | 21 / 7 — AD7829-1. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Rating. ESD CAUTION |
| Dateiformat / Größe | PDF / 364 Kb |
| Dokumentensprache | Englisch |
AD7829-1. ABSOLUTE MAXIMUM RATINGS. Table 3. Parameter Rating. ESD CAUTION
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AD7829-1 ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress VDD to AGND −0.3 V to +7 V rating only; functional operation of the device at these or any VDD to DGND −0.3 V to +7 V other conditions above those indicated in the operational Analog Input Voltage to AGND section of this specification is not implied. Exposure to absolute VIN1 to VIN8 −0.3 V to VDD + 0.3 V maximum rating conditions for extended periods may affect Reference Input Voltage to AGND −0.3 V to VDD + 0.3 V device reliability. VMID Input Voltage to AGND −0.3 V to VDD + 0.3 V Digital Input Voltage to DGND −0.3 V to VDD + 0.3 V Digital Output Voltage to DGND −0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C TSSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 128°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C ESD 1 kV
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. 0 | Page 6 of 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS TIMING DIAGRAM ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY CIRCUIT INFORMATION CIRCUIT DESCRIPTION TYPICAL CONNECTION DIAGRAM ADC TRANSFER FUNCTION ANALOG INPUT POWER-UP TIMES POWER VS. THROUGHPUT OPERATING MODES PARALLEL INTERFACE MICROPROCESSOR INTERFACING AD7829-1 TO 8051 AD7829-1 TO PIC16C6x/PIC16C7x AD7829-1 TO ADSP-21xx INTERFACING MULTIPLEXER ADDRESS INPUTS OUTLINE DIMENSIONS ORDERING GUIDE
TA = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
Parameter Rating
may cause permanent damage to the device. This is a stress VDD to AGND −0.3 V to +7 V rating only; functional operation of the device at these or any VDD to DGND −0.3 V to +7 V other conditions above those indicated in the operational Analog Input Voltage to AGND section of this specification is not implied. Exposure to absolute VIN1 to VIN8 −0.3 V to VDD + 0.3 V maximum rating conditions for extended periods may affect Reference Input Voltage to AGND −0.3 V to VDD + 0.3 V device reliability. VMID Input Voltage to AGND −0.3 V to VDD + 0.3 V Digital Input Voltage to DGND −0.3 V to VDD + 0.3 V Digital Output Voltage to DGND −0.3 V to VDD + 0.3 V Operating Temperature Range Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Junction Temperature 150°C SOIC Package, Power Dissipation 450 mW θJA Thermal Impedance 75°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C TSSOP Package, Power Dissipation 450 mW θJA Thermal Impedance 128°C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215°C Infrared (15 sec) 220°C ESD 1 kV
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. Rev. 0 | Page 6 of 20 Document Outline FEATURES APPLICATIONS GENERAL DESCRIPTION FUNCTIONAL BLOCK DIAGRAM PRODUCT HIGHLIGHTS TABLE OF CONTENTS REVISION HISTORY SPECIFICATIONS TIMING CHARACTERISTICS TIMING DIAGRAM ABSOLUTE MAXIMUM RATINGS ESD CAUTION PIN CONFIGURATION AND FUNCTION DESCRIPTIONS TERMINOLOGY CIRCUIT INFORMATION CIRCUIT DESCRIPTION TYPICAL CONNECTION DIAGRAM ADC TRANSFER FUNCTION ANALOG INPUT POWER-UP TIMES POWER VS. THROUGHPUT OPERATING MODES PARALLEL INTERFACE MICROPROCESSOR INTERFACING AD7829-1 TO 8051 AD7829-1 TO PIC16C6x/PIC16C7x AD7829-1 TO ADSP-21xx INTERFACING MULTIPLEXER ADDRESS INPUTS OUTLINE DIMENSIONS ORDERING GUIDE