Datasheet HMCAD5831LP9BE (Analog Devices) - 7

HMCAD5831LP9BE
v02.0713
3-BIT 26 GSPS ANALOG-TO-DIGITAL CONVERTER W/ OVERRANGE, INHIBIT, AND 1:2 DEMUX Operating Conditions
Parameter Description Min. typ. Max. Units av analog supply voltage range -5.5 -5.0 -4.5 v ee t ov Digital and output driver supply voltage range -3.6 -3.3 -3.0 v ee M v In, CKx, Xorx, and Qtx inputs voltage -2.0 +0.5 v input s v Xxx, Yxx, and oCLKx outputs voltage -1.5 +0.5 v output aGnD-oGnD -0.3 0 +0.3 v s - ambient temperature r t Limited by the Absolute Maximum junction temperature -40 +85
°
C a limit and depends upon the system thermal design e t note 1: the conditions listed in this table must be observed for the device to be functional as specified in this document. these conditions do not r guarantee specific performance levels, which are listed in the DC, aC, and switching specification tables and apply under the test conditions specified therein. e note 2: all voltages are in reference to the aGnD pin of the device. v n o eLeCtrostatIC sensItIve DevICe oBserve HanDLInG PreCaUtIons ata C D
Absolute Maximum Ratings
Parameter Description Min. typ. Max. Units t Junction temperature +125 °C J t storage temperature -65 +150 °C storage av analog supply voltage -5.8 +0.5 v ee ov Digital and output driver supply voltage range -5.8 +0.5 v ee v In, CKx, Xorx, and Qtx inputs voltage v - 0.3 aGnD+0.8 v input ee v Xxx, Yxx, and oCLKx outputs voltage ov - 0.3 oGnD+0.8 v output ee esD rating Human body model (Class 1C) 1k v note 1: operating the device beyond the limits specified in this table may cause immediate damage to the device. Functional operation of the device is further limited by the operating Conditions. Device functionality is not implied by the absolute Maximum ratings. note 2: all voltages are in reference to aGnD pin of the device.
Thermal Information
Parameter Description Min. typ. Max. Units Θ thermal resistance - junction-to-case bottom pad 2.5 °C/W JCb note 1: the thermal pad at the bottom of the device package must be attached to a PCB ground plane for conduction purposes as this is the most main path of heat dissipation of this device. It is also strongly recommended that the thermal pad should be connected to a metal pad on the underside of the PCB through multiple vias and that a heat sink should always be attached to this PCB metal pad. Inf F or o m r p atio r n ifc ur e n , d ishe e d lbiv y e A r n y a alog n D d t evic o p es is la beclie o eved rd to ebre sa: H ccur iattti e tae M nd re ilicarbloew . H a o ve C wever, o n rp o For price, delivery, and to place orders: Analog Devices, Inc., responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other oration, 2 Elizabeth Drive, Chelmsford, MA 01824 One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 Phone: 978-250-3343 Fax: 978-250-3373 O rights of third parties that may result from its use. Specifications subject to change without notice. No P rd hone e r O : 7 n 81- -3li 2n 9 e a -47 t w 0 w 0 • O w rd .h e it r o t niltie n .c e ao t m license is granted by implication or otherwise under any patent or patent rights of Analog Devices. www.analog.com
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Application Support: Pho Trademarks and registered trademarks are the property of their respective owners. ne: 978-250-33 A 4 pp3li o ca rti a o pp n Susp@h portitti : P te ho .c neom : 1-800-ANALOG-D