Datasheet MCP6L1, MCP6L1R, MCP6L2, MCP6L4 (Microchip) - 3

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MCP6L1/1R/2/4 1.0 ELECTRICAL † Notice:
Stresses above those listed under “Absolute Maxi-
CHARACTERISTICS
mum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those, or any other conditions above those indi-
1.1 Absolute Maximum Ratings †
cated in the operational listings of this specification, is not implied. Exposure to maximum rating conditions for extended VDD – VSS ...7.0V periods may affect device reliability. Current at Input Pins ..±2 mA †† See
Section 4.1.2 “Input Voltage and Current Limits”
. Analog Inputs (VIN+, VIN-) †† .. VSS – 1.0V to VDD + 1.0V All Inputs and Outputs ... VSS – 0.3V to VDD + 0.3V Difference Input voltage .. |VDD – VSS| Output Short Circuit Current .. Continuous Current at Output and Supply Pins ..±30 mA Storage Temperature ...-65°C to +150°C Max. Junction Temperature .. +150°C ESD Protection on All Pins (HBM, MM)  3 kV, 200V
1.2 Specifications TABLE 1-1: DC ELECTRICAL SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, TA = +25°C, VDD = 5.0V, VSS = GND, VCM = VSS, VOUT  VDD/2, VL = VDD/2, and RL = 10 k to VL (refer to Figure 1-1).
Min Max Parameters Sym Typ Units Conditions (Note 1) (Note 1) Input Offset
Input Offset Voltage VOS -3 ±1 +3 mV Input Offset Voltage Drift VOS/TA — ±2.5 — µV/°C TA= -40°C to+125°C Power Supply Rejection Ratio PSRR — 90 — dB
Input Current and Impedance
Input Bias Current IB — 1 — pA Across Temperature IB — 20 — pA TA= +85°C Across Temperature IB — 500 — pA TA= +125°C Input Offset Current IOS — ±1 — pA Common-Mode Input Impedance ZCM — 1013||5 — ||pF Differential Input Impedance ZDIFF — 1013||2 — ||pF
Common-Mode
Common-Mode Input Voltage Range VCMR -0.3 — 3.7 V Common-Mode Rejection Ratio CMRR — 90 — dB VCM = -0.3V to 3.7V
Open-Loop Gain
DC Open-Loop Gain (large signal) AOL — 105 — dB VOUT = 0.2V to 4.8V
Output
Maximum Output Voltage Swing VOL — — 0.030 V G = +2, 0.5V Input Overdrive VOH 4.960 — — V G = +2, 0.5V Input Overdrive Output Short Circuit Current ISC — ±20 — mA
Power Supply
Supply Voltage VDD 2.7 — 6.0 V Quiescent Current per Amplifier IQ 70 200 330 µA IO = 0
Note 1:
For design guidance only; not tested.  2009-2012 Microchip Technology Inc. DS22135C-page 3 Document Outline MCP6L1/1R/2/4 - 2.8 MHz, 200 μA Op Amps 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuit FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage vs. Common-Mode Input Voltage at VDD = 2.7V. FIGURE 2-2: Input Offset Voltage vs. Common-Mode Input Voltage at VDD = 5.5V. FIGURE 2-3: Input Offset Voltage vs. Ambient Temperature. FIGURE 2-4: Input Common-Mode Range Voltage vs. Ambient Temperature. FIGURE 2-5: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-6: CMRR, PSRR vs. Frequency. FIGURE 2-7: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-8: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Frequency. FIGURE 2-10: The MCP6L1/1R/2/4 Show No Phase Reversal. FIGURE 2-11: Quiescent Current vs. Power Supply Voltage. FIGURE 2-12: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-13: Ratio of Output Voltage Headroom to Output Current vs. Output Current. FIGURE 2-14: Small Signal, Non-Inverting Pulse Response. FIGURE 2-15: Large Signal, Non-Inverting Pulse Response. FIGURE 2-16: Slew Rate vs. Ambient Temperature. FIGURE 2-17: Output Voltage Swing vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 4.0 Application Information 4.1 Inputs FIGURE 4-1: Protecting the Analog Inputs. FIGURE 4-2: Unity Gain Buffer has a Limited VOUT Range. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-3: Output Resistor, RISO, Stabilizes Large Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-4: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-5: Example Guard Ring Layout. 4.7 Application Circuits FIGURE 4-6: Sallen Key Topology. FIGURE 4-7: Multiple Feedback Topology. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service