Datasheet MCP6H71, MCP6H72, MCP6H74 (Microchip) - 3

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MCP6H71/2/4 1.0 ELECTRICAL † Notice:
Stresses above those listed under “Absolute
CHARACTERISTICS
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions
1.1 Absolute Maximum Ratings †
above those indicated in the operational listings of this V specification is not implied. Exposure to maximum DD – VSS...13.2V rating conditions for extended periods may affect Current at Input Pins..±2 mA device reliability. Analog Inputs (VIN+, VIN-)††...VSS – 1.0V to VDD + 1.0V
††
See
Section 4.1.2, Input Voltage Limits .
All Other Inputs and Outputs ..VSS – 0.3V to VDD + 0.3V Difference Input Voltage..VDD – VSS Output Short-Circuit Current...continuous Current at Output and Supply Pins ..±65 mA Storage Temperature...-65°C to +150°C Maximum Junction Temperature (TJ)...+150°C ESD protection on all pins (HBM; MM) 2 kV; 200V
DC ELECTRICAL SPECIFICATIONS Electrical Characteristics
: Unless otherwise indicated, VDD = +3.5V to +12V, VSS = GND, TA = +25°C, V  CM = VDD/2 - 1.4V, VOUT VDD/2, VL = VDD/2 and RL = 10 kto VL. (Refer to Figure 1-1).
Parameters Sym. Min. Typ. Max. Units Conditions Input Offset
Input Offset Voltage VOS -4 ±1 4 mV Input Offset Drift with Temperature VOS/TA — ±2.5 — µV/°C TA = -40°C to +125°C Power Supply Rejection Ratio PSRR 82 105 — dB
Input Bias Current and Impedance
Input Bias Current IB — 10 — pA — 400 — pA TA = +85°C — 9 25 nA TA = +125°C Input Offset Current IOS — ±1 — pA Common Mode Input Impedance ZCM — 1013||6 — ||pF Differential Input Impedance ZDIFF — 1013||6 — ||pF
Common Mode
Common Mode Input Voltage Range VCMR VSS – 0.3 — VDD – 2.5 V Common Mode Rejection Ratio CMRR 76 96 — dB VCM = -0.3V to 1.0V, VDD = 3.5V 80 99 — dB VCM = -0.3V to 2.5V, VDD = 5V 80 103 — dB VCM = -0.3V to 9.5V, VDD = 12V
Open-Loop Gain
DC Open-Loop Gain (Large Signal) AOL 100 120 — dB 0.2V < VOUT <(VDD – 0.2V)  2012-2014 Microchip Technology Inc. DS20002325C-page 3 Document Outline Features Applications Design Aids Description Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-10: CMRR, PSRR vs. Frequency. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-13: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-14: Quiescent Current vs. Ambient Temperature. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage. FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6H72/4 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Output Current. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-30: Slew Rate vs. Ambient Temperature. FIGURE 2-31: Slew Rate vs. Ambient Temperature. FIGURE 2-32: Small Signal Non-Inverting Pulse Response. FIGURE 2-33: Small Signal Inverting Pulse Response. FIGURE 2-34: Large Signal Non-Inverting Pulse Response. FIGURE 2-35: Large Signal Inverting Pulse Response. FIGURE 2-36: The MCP6H71/2/4 Shows No Phase Reversal. FIGURE 2-37: Closed-Loop Output Impedance vs. Frequency. FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Application Circuits FIGURE 4-8: High-Side Current Sensing Using Difference Amplifier. FIGURE 4-9: Active Full-Wave Rectifier. FIGURE 4-10: Triangle Waves Generator. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service