Datasheet MCP6H71, MCP6H72, MCP6H74 (Microchip)

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MCP6H71/2/4 2.7 MHz, 12V Op Amps Features: Description:
• Input Offset Voltage: ±1 mV (typical) Microchip’s MCP6H71/2/4 family of operational • Quiescent Current: 480 µA (typical) amplifiers (op amps) has a wide supply voltage range • Common Mode Rejection Ratio: 103 dB (typical) of 3.5V to 12V and rail-to-rail output operation. This family is unity gain stable and has a gain bandwidth • Power Supply Rejection Ratio: 105 dB (typical) product of 2.7 MHz (typical). These devices operate • Rail-to-Rail Output with a single-supply voltage as high as 12V, while only • Supply Voltage Range: drawing 480 µA/amplifier (typical) of quiescent current. - Single-Supply Operation: 3.5V to 12V The MCP6H71/2/4 family is offered in single - Dual-Supply Operation: ±1.75V to ±6V (MCP6H71), dual (MCP6H72) and quad (MCP6H74) • Gain Bandwidth Product: 2.7 MHz (typical) configurations. All devices are fully specified in • Slew Rate: 2 V/µs (typical) extended temperature range from -40°C to +125°C. • Unity Gain Stable
Package Types
• Extended Temperature Range: -40°C to +125°C • No Phase Reversal
MCP6H71 MCP6H72 Applications:
SOIC SOIC NC 1 8 NC V 1 8 V OUTA DD • Automotive Power Electronics V 2 7 VDD V 2 7 VOUTB • Industrial Control Equipment IN– INA– V 3 6 V V IN+ OUT INA+ 3 6 VINB– • Battery Powered Systems V 4 5 NC V V SS SS 4 5 INB+ • Sensor Conditioning
MCP6H71 MCP6H72 Design Aids:
2x3 TDFN 2x3 TDFN • SPICE Macro Models NC 1 8 NC VOUTA 1 8 VDD • FilterLab® Software VIN– 2 EP 7 VDD VINA– 2 EP 7 VOUTB • MAPS (Microchip Advanced Part Selector) 9 V 9 IN+ 3 6 VOUT VINA+ 3 6 VINB– • Analog Demonstration and Evaluation Boards V 4 5 NC SS V 4 5 V SS INB+ • Application Notes
MCP6H74 Typical Application
SOIC, TSSOP V 1 14 VOUTD R OUTA 1 R2 2 13 V V V V INA– IND– 1 REF V 3 12 V V INA+ IND+ DD V V DD 4 11 SS V V OUT INB+ 5 10 VINC+
MCP6H71
VINB– 6 9 VINC– VOUTB 7 8 VOUTC V2 * Includes Exposed Thermal Pad (EP); see Table 3-1. R R 1 2
Difference Amplifier
 2012-2014 Microchip Technology Inc. DS20002325C-page 1 Document Outline Features Applications Design Aids Description Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-6: Input Offset Voltage vs. Output Voltage. FIGURE 2-7: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-10: CMRR, PSRR vs. Frequency. FIGURE 2-11: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-12: Input Bias, Offset Currents vs. Ambient Temperature. FIGURE 2-13: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-14: Quiescent Current vs. Ambient Temperature. FIGURE 2-15: Quiescent Current vs. Power Supply Voltage. FIGURE 2-16: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-17: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-18: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-19: Channel-to-Channel Separation vs. Frequency (MCP6H72/4 only). FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Output Current. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-29: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-30: Slew Rate vs. Ambient Temperature. FIGURE 2-31: Slew Rate vs. Ambient Temperature. FIGURE 2-32: Small Signal Non-Inverting Pulse Response. FIGURE 2-33: Small Signal Inverting Pulse Response. FIGURE 2-34: Large Signal Non-Inverting Pulse Response. FIGURE 2-35: Large Signal Inverting Pulse Response. FIGURE 2-36: The MCP6H71/2/4 Shows No Phase Reversal. FIGURE 2-37: Closed-Loop Output Impedance vs. Frequency. FIGURE 2-38: Measured Input Current vs. Input Voltage (below VSS). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 3.4 Exposed Thermal Pad (EP) 4.0 Application Information 4.1 Inputs FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Application Circuits FIGURE 4-8: High-Side Current Sensing Using Difference Amplifier. FIGURE 4-9: Active Full-Wave Rectifier. FIGURE 4-10: Triangle Waves Generator. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 MAPS (Microchip Advanced Part Selector) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service