Datasheet MCP6L71, MCP6L71R, MCP6L72, MCP6L74 (Microchip) - 4

link to page 4 link to page 5
MCP6L71/1R/2/4 TABLE 1-1: DC ELECTRICAL SPECIFICATIONS (CONTINUED) Electrical Characteristics
: Unless otherwise indicated, TA = +25°C, VDD = 5.0V, VSS = GND, VCM = VDD/2, V ≈ OUT VDD/2, VL = VDD/2 and RL = 10 kΩ to VL. (Refer to Figure 1-1).
Min Max Parameters Sym Typ Units Conditions (Note 1) (Note 1) Power Supply
Supply Voltage VDD 2.0 — 6.0 V Quiescent Current per Amplifier IQ 50 150 240 µA IO = 0
Note 1:
For design guidance only; not tested.
TABLE 1-2: AC ELECTRICAL SPECIFICATIONS Electrical Characteristics
: Unless otherwise indicated, TA = +25°C, VDD = +2.0V to +5.5V, VSS = GND, V ≈ CM = VDD2, VOUT VDD/2, VL = VDD/2, RL = 10 kΩ to VL and CL = 60 pF. (Refer to Figure 1-1).
Parameters Sym Min Typ Max Units Conditions AC Response
Gain Bandwidth Product GBWP — 2.0 — MHz Phase Margin PM — 65 — ° G = +1 V/V Slew Rate SR — 0.9 — V/µs
Noise
Input Noise Voltage Eni — 4.6 — µVP-P f = 0.1 Hz to 10 Hz Input Noise Voltage Density eni — 19 — nV/√Hz f = 10 kHz Input Noise Current Density ini — 3 — fA/√Hz f = 1 kHz
TABLE 1-3: TEMPERATURE SPECIFICATIONS Electrical Characteristics:
Unless otherwise indicated, VDD = +2.0V to +5.5V and VSS = GND.
Parameters Sym Min Typ Max Units Conditions Temperature Ranges
Specified Temperature Range TA –40 — +125 °C Operating Temperature Range TA –40 — +125 °C
Note 1
Storage Temperature Range TA –65 — +150 °C
Thermal Package Resistances
Thermal Resistance, 5L-SOT-23 θJA — 256 — °C/W Thermal Resistance, 8L-SOIC θJA — 163 — °C/W Thermal Resistance, 8L-MSOP θJA — 206 — °C/W Thermal Resistance, 14L-SOIC θJA — 120 — °C/W Thermal Resistance, 14L-TSSOP θJA — 100 — °C/W
Note 1:
The Junction Temperature (TJ) must not exceed the Absolute Maximum specification of +150°C. DS22145A-page 4 © 2009 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC Electrical Specifications (Continued) TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 2.0V. FIGURE 2-2: Input Offset Voltage vs. Common Mode Input Voltage at VDD = 5.5V. FIGURE 2-3: Input Offset Voltage vs. Output Voltage. FIGURE 2-4: Input Common Mode Range Voltage vs. Ambient Temperature. FIGURE 2-5: CMRR, PSRR vs. Temperature. FIGURE 2-6: CMRR, PSRR vs. Frequency. FIGURE 2-7: Input Current vs. Input Voltage. FIGURE 2-8: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-9: Input Noise Voltage Density vs. Frequency. FIGURE 2-10: The MCP6L71/1R/2/4 Show No Phase Reversal. FIGURE 2-11: Quiescent Current vs. Supply Voltage. FIGURE 2-12: Output Short Circuit Current vs. Supply Voltage. FIGURE 2-13: Ratio of Output Voltage Headroom vs. Output Current Magnitude. FIGURE 2-14: Large Signal Non-inverting Pulse Response. FIGURE 2-15: Small Signal Non-inverting Pulse Response. FIGURE 2-16: Slew Rate vs. Ambient Temperature. FIGURE 2-17: Maximum Output Voltage Swing vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table for Single Op Amps TABLE 3-2: Pin Function Table for Dual and Quad Op Amps 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins 4.0 Application Information 4.1 Rail-to-Rail Inputs FIGURE 4-1: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-2: Output Resistor, RISO Stabilizes Large Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Amplifiers FIGURE 4-3: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-4: Example Guard Ring Layout. 4.7 Application Circuits FIGURE 4-5: Inverting Integrator. 5.0 Design Tools 5.1 FilterLab® Software 5.2 MAPS (Microchip Advanced Part Selector) 5.3 Analog Demonstration and Evaluation Boards 5.4 Application Notes 6.0 Packaging Information 6.1 Package Marking Information