Datasheet MCP6421, MCP6422, MCP6424 (Microchip) - 9

MCP6421/2/4 Note:
Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS= GND, VCM = VDD/2, VOUT = VDD/2, VL = VDD/2, RL = 100 k to VL and CL = 30 pF.
6 6 V = 5.5V DD 5 5 V = 1.8V DD 4 4 3 3 iescent Current 2 u (μA/Amplifier) 2 uiescent Current (μA/Amplifier) O Q 1 1 V = 5.5V DD G = +1 V/V 0 0 -50 -25 0 25 50 75 100 125 -0.5 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Ambient Temperature (°C) Common Mode Input Voltage (V) FIGURE 2-13:
Quiescent Current vs.
FIGURE 2-16:
Quiescent Current vs. Ambient Temperature. Common Mode Input Voltage.
6 120 0 Open-Loop Gain 5 100 -30 (°) 80 -60 4 Open-Loop Phase 60 -90 3 T = +125°C 40 -120 A -Loop Gain (dB) -Loop Phase 2 uiescent Current (μA/Amplifier) T = +85°C n n A Q T = +25°C ° 20 -150 A T = -40°C 1 Ope Ope A 0 -180 0 -20 -210 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 1.0E+04 1.0E+05 0.01 0.1 1 10 100 1k 10k 100k Power Supply Voltage (V) Frequency (Hz) FIGURE 2-14:
Quiescent Current vs.
FIGURE 2-17:
Open-Loop Gain, Phase vs. Power Supply Voltage. Frequency.
6 140 V = 5.5V 5 DD 130 4 120 V = 1.8V DD 3 110 iescent Current μA/Amplifier) 2 u ( 100 Open-Loop Gain (dB) O 1 DC 90 V = 1.8V DD G = +1 V/V 0 80 -0.5 -0.2 0.1 0.4 0.7 1.0 1.3 1.6 1.9 2.2 2.5 -50 -25 0 25 50 75 100 125 Common Mode Input Voltage (V) Ambient Temperature (°C) FIGURE 2-15:
Quiescent Current vs.
FIGURE 2-18:
DC Open-Loop Gain vs. Common Mode Input Voltage. Ambient Temperature.  2013 Microchip Technology Inc. DS20005165B-page 9 Document Outline Typical Application Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC electrical specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Slew Rate vs. Ambient Temperature. FIGURE 2-29: Small Signal Non-Inverting Pulse Response. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-Inverting Pulse Response. FIGURE 2-32: Large Signal Inverting Pulse Response. FIGURE 2-33: The MCP6421/2/4 Device Shows No Phase Reversal. FIGURE 2-34: Closed Loop Output Impedance vs. Frequency. FIGURE 2-35: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-36: EMIRR vs. Frequency. FIGURE 2-37: EMIRR vs. RF Input Peak- to-Peak Voltage. FIGURE 2-38: Channel-to-Channel Separation vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins (VSS, VDD) 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Electromagnetic Interference Rejection Ratio (EMIRR) Definitions 4.8 Application Circuits FIGURE 4-8: CO Gas Sensor Circuit. FIGURE 4-9: Pressure Sensor Amplifier. FIGURE 4-10: Battery Current Sensing. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service