Datasheet MCP6421, MCP6422, MCP6424 (Microchip) - 3

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MCP6421/2/4 1.0 ELECTRICAL CHARACTERISTICS 1.1 Absolute Maximum Ratings †
VDD – VSS ..6.5V Current at Analog Input Pins (VIN+, VIN-)..±2 mA Analog Inputs (VIN+, VIN-)
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...VSS – 1.0V to VDD + 1.0V All Other Inputs and Outputs ..VSS – 0.3V to VDD + 0.3V Difference Input Voltage ...|VDD – VSS| Output Short-Circuit Current .. Continuous Current at Input Pins ... ±2 mA Current at Output and Supply Pins .. ±30 mA Storage Temperature .. -65°C to +150°C Maximum Junction Temperature (TJ).. +150°C ESD Protection on All Pins (HBM; MM)  4 kV; 400V ESD Protection on All Pins (HBM; MM) (Dual and Quad)  4 kV; 300V
† Notice:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
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See
Section 4.1.2 “Input Voltage Limits”
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1.2 Specifications TABLE 1-1: DC ELECTRICAL SPECIFICATIONS Electrical Characteristics
: Unless otherwise indicated, TA= +25°C, VDD = +1.8V to +5.5V, VSS= GND, VCM = VDD/2, VOUT = VDD/2, VL = VDD/2, RL = 100 k to VL and CL = 30 pF (refer to Figure 1-1).
Parameters Sym. Min. Typ. Max. Units Conditions Input Offset
Input Offset Voltage VOS -1.0 — 1.0 mV VDD = 3.0V; VCM = VDD/4 Input Offset Drift with Temperature VOS/TA — ±3.0 — µV/°C TA= -40°C to +125°C, VCM = VSS Power Supply Rejection Ratio PSRR 75 90 — dB VCM = VSS
Input Bias Current and Impedance
Input Bias Current IB — ±1 50 pA — 20 — pA TA = +85°C — 800 — pA TA = +125°C Input Offset Current IOS — ±1 — pA Common Mode Input Impedance ZCM — 1013||12 — ||pF Differential Input Impedance ZDIFF — 1013||12 — |pF
Common Mode
Common Mode Input Voltage VCMR VSS – 0.3 — VDD + 0.3 V Range Common Mode Rejection Ratio CMRR 75 90 — dB VDD = 5.5V VCM = -0.3V to 5.8V 70 85 — dB VDD = 1.8V VCM = -0.3V to 2.1V  2013 Microchip Technology Inc. DS20005165B-page 3 Document Outline Typical Application Package Types 1.0 Electrical Characteristics 1.1 Absolute Maximum Ratings † 1.2 Specifications TABLE 1-1: DC electrical specifications TABLE 1-2: AC Electrical Specifications TABLE 1-3: Temperature Specifications 1.3 Test Circuits FIGURE 1-1: AC and DC Test Circuit for Most Specifications. 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-8: Input Noise Voltage Density vs. Frequency. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-16: Quiescent Current vs. Common Mode Input Voltage. FIGURE 2-17: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-18: DC Open-Loop Gain vs. Ambient Temperature. FIGURE 2-19: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-20: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-21: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-22: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-23: Output Voltage Swing vs. Frequency. FIGURE 2-24: Output Voltage Headroom vs. Output Current. FIGURE 2-25: Output Voltage Headroom vs. Output Current. FIGURE 2-26: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-27: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-28: Slew Rate vs. Ambient Temperature. FIGURE 2-29: Small Signal Non-Inverting Pulse Response. FIGURE 2-30: Small Signal Inverting Pulse Response. FIGURE 2-31: Large Signal Non-Inverting Pulse Response. FIGURE 2-32: Large Signal Inverting Pulse Response. FIGURE 2-33: The MCP6421/2/4 Device Shows No Phase Reversal. FIGURE 2-34: Closed Loop Output Impedance vs. Frequency. FIGURE 2-35: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-36: EMIRR vs. Frequency. FIGURE 2-37: EMIRR vs. RF Input Peak- to-Peak Voltage. FIGURE 2-38: Channel-to-Channel Separation vs. Frequency. 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 3.1 Analog Outputs 3.2 Analog Inputs 3.3 Power Supply Pins (VSS, VDD) 4.0 Application Information 4.1 Rail-to-Rail Input FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. 4.2 Rail-to-Rail Output 4.3 Capacitive Loads FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. 4.4 Supply Bypass 4.5 Unused Op Amps FIGURE 4-6: Unused Op Amps. 4.6 PCB Surface Leakage FIGURE 4-7: Example Guard Ring Layout for Inverting Gain. 4.7 Electromagnetic Interference Rejection Ratio (EMIRR) Definitions 4.8 Application Circuits FIGURE 4-8: CO Gas Sensor Circuit. FIGURE 4-9: Pressure Sensor Amplifier. FIGURE 4-10: Battery Current Sensing. 5.0 Design Aids 5.1 SPICE Macro Model 5.2 FilterLab® Software 5.3 Microchip Advanced Part Selector (MAPS) 5.4 Analog Demonstration and Evaluation Boards 5.5 Application Notes 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service