Datasheet MCP6441, MCP6442, MCP6444 (Microchip) - 10

MCP6441/2/4 Note:
Unless otherwise indicated, T ≈ A = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF.
1.E-03 1m n 150 1.E-04 100µ tion 140 ra 1.E-05 10µ aratio a 130 p ep 1.E-06 1µ e 120 ) l S l S e 1.E 1 -07 00n n ) 110 (A B B) 1.E-08 an nne (d -I IN 10n T (d 100 A = -40°C h a 1.E-09 1n TA = +25°C h C 90 TA = +85°C C 1.E-10 100p T o el to 80 A = +125°C l t n 1.E-11 10p 70 Input Referred an h 1.E-12 1p nne a C 60 -1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 -0.3 -0.2 -0.1 0.0 h 100 100 1k 10k C 100 1000 1k 10000 Input Voltage (V) Frequency (Hz) FIGURE 2-31:
Measured Input Current vs.
FIGURE 2-32:
Channel-to-Channel Input Voltage (below VSS). Separation vs. Frequency (MCP6442/4 only). DS22257C-page 10 © 2010-2012 Microchip Technology Inc. Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 6.0V. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-16: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-18: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Output Voltage Swing vs. Frequency. FIGURE 2-22: Output Voltage Headroom vs. Output Current. FIGURE 2-23: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-24: Slew Rate vs. Ambient Temperature. FIGURE 2-25: Small Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Inverting Pulse Response. FIGURE 2-27: Large Signal Non-Inverting Pulse Response. FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: The MCP6441/2/4 Device Shows No Phase Reversal. FIGURE 2-30: Closed Loop Output Impedance vs. Frequency. FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: Channel-to-Channel Separation vs. Frequency (MCP6442/4 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Application Information FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. FIGURE 4-7: Battery Current Sensing. FIGURE 4-8: Precision Half-Wave Rectifier. FIGURE 4-9: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service