Datasheet MCP6441, MCP6442, MCP6444 (Microchip) - 9

MCP6441/2/4 Note:
Unless otherwise indicated, T ≈ A = +25°C, VDD = +1.4V to +6.0V, VSS = GND, VCM = VDD/2, VOUT VDD/2, VL = VDD/2, RL = 1 MΩ to VL and CL = 60 pF.
6.0 ) 5.5 iv 5.0 v/d ) 4.5 VDD = 6.0V m (V G = -1 V/V e 4.0 (20 e 3.5 ltag o 3.0 ltag o t V 2.5 u t V tp 2.0 u VDD = 6.0V u tp G = +1 V/V O 1.5 u O 1.0 0.5 0.0 Time (200 µs/div) Time (2 ms/div) FIGURE 2-25:
Small Signal Non-Inverting
FIGURE 2-28:
Large Signal Inverting Pulse Pulse Response. Response.
7.0 iv) ) 6.0 /d VDD = 6.0V (V v G = -1 V/V 5.0 V m OUT ltage VIN (20 4.0 o e t V 3.0 u ltag o tp u 2.0 t V u t,O u 1.0 V tp p DD = 6.0V u In G = +2 V/V O 0.0 -1.0 Time (200 µs/div) Time (2 ms/div) FIGURE 2-26:
Small Signal Inverting Pulse
FIGURE 2-29:
The MCP6441/2/4 Device Response. Shows No Phase Reversal.
6.0
1000000
1M 5.5
100000
100k 5.0 ut ) ) 4.5 tp V u
10000
10k 4.0 O (Ω p 3.5 o ltage ( nce
1000
1k o 3.0 Lo eda GN: t V 2.5 p u ed
100
100 101 V/V V tp 2.0 DD = 6.0V los Im 11 V/V G = +1 V/V C 1 V/V Ou 1.5
10
10 1.0 1 0.5
1 1 10 100 1000 10000
1 10 100 1k 10k 0.0 Time (2 ms/div) Frequency (Hz) FIGURE 2-27:
Large Signal Non-Inverting
FIGURE 2-30:
Closed Loop Output Pulse Response. Impedance vs. Frequency. © 2010-2012 Microchip Technology Inc. DS22257C-page 9 Document Outline 1.0 Electrical Characteristics 2.0 Typical Performance Curves FIGURE 2-1: Input Offset Voltage. FIGURE 2-2: Input Offset Voltage Drift. FIGURE 2-3: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 6.0V. FIGURE 2-4: Input Offset Voltage vs. Common Mode Input Voltage with VDD = 1.4V. FIGURE 2-5: Input Offset Voltage vs. Output Voltage. FIGURE 2-6: Input Offset Voltage vs. Power Supply Voltage. FIGURE 2-7: Input Noise Voltage Density vs. Frequency. FIGURE 2-8: Input Noise Voltage Density vs. Common Mode Input Voltage. FIGURE 2-9: CMRR, PSRR vs. Frequency. FIGURE 2-10: CMRR, PSRR vs. Ambient Temperature. FIGURE 2-11: Input Bias, Offset Current vs. Ambient Temperature. FIGURE 2-12: Input Bias Current vs. Common Mode Input Voltage. FIGURE 2-13: Quiescent Current vs. Ambient Temperature. FIGURE 2-14: Quiescent Current vs. Power Supply Voltage. FIGURE 2-15: Open-Loop Gain, Phase vs. Frequency. FIGURE 2-16: DC Open-Loop Gain vs. Power Supply Voltage. FIGURE 2-17: DC Open-Loop Gain vs. Output Voltage Headroom. FIGURE 2-18: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-19: Gain Bandwidth Product, Phase Margin vs. Ambient Temperature. FIGURE 2-20: Output Short Circuit Current vs. Power Supply Voltage. FIGURE 2-21: Output Voltage Swing vs. Frequency. FIGURE 2-22: Output Voltage Headroom vs. Output Current. FIGURE 2-23: Output Voltage Headroom vs. Ambient Temperature. FIGURE 2-24: Slew Rate vs. Ambient Temperature. FIGURE 2-25: Small Signal Non-Inverting Pulse Response. FIGURE 2-26: Small Signal Inverting Pulse Response. FIGURE 2-27: Large Signal Non-Inverting Pulse Response. FIGURE 2-28: Large Signal Inverting Pulse Response. FIGURE 2-29: The MCP6441/2/4 Device Shows No Phase Reversal. FIGURE 2-30: Closed Loop Output Impedance vs. Frequency. FIGURE 2-31: Measured Input Current vs. Input Voltage (below VSS). FIGURE 2-32: Channel-to-Channel Separation vs. Frequency (MCP6442/4 only). 3.0 Pin Descriptions TABLE 3-1: Pin Function Table 4.0 Application Information FIGURE 4-1: Simplified Analog Input ESD Structures. FIGURE 4-2: Protecting the Analog Inputs. FIGURE 4-3: Protecting the Analog Inputs. FIGURE 4-4: Output Resistor, RISO Stabilizes Large Capacitive Loads. FIGURE 4-5: Recommended RISO Values for Capacitive Loads. FIGURE 4-6: Example Guard Ring Layout for Inverting Gain. FIGURE 4-7: Battery Current Sensing. FIGURE 4-8: Precision Half-Wave Rectifier. FIGURE 4-9: Two Op Amp Instrumentation Amplifier. 5.0 Design Aids 6.0 Packaging Information 6.1 Package Marking Information Appendix A: Revision History Product Identification System Trademarks Worldwide Sales and Service