Datasheet NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 (ON Semiconductor) - 5

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NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074 ABSOLUTE MAXIMUM RATINGS
(Note 1)
Rating Symbol Limit Unit
Supply Voltage (VDD – VSS) (Note 4) VS 40 V Input Voltage VCM VSS − 0.2 to VDD + 0.2 V Differential Input Voltage (Note 2) VID ±Vs V Maximum Input Current IIN ±10 mA Maximum Output Current (Note 3) IO ±100 mA Continuous Total Power Dissipation (Note 4) PD 200 mW Maximum Junction Temperature TJ 150 °C Storage Temperature Range TSTG −65 to 150 °C Mounting Temperature (Infrared or Convection – 20 sec) Tmount 260 °C ESD Capability (Note 5) Human Body Model HBM 2000 V Machine Model − NCx20071 MM 200 Machine Model − NCx20072, NCx20074 MM 150 Charged Device Model − NCx20071, NCx20072 CDM 2000 (C6) Charged Device Model − NCx20074 CDM 1000 (C6) Latch−Up Current (Note 6) ILU 100 mA Moisture Sensitivity Level (Note 7) MSL Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 2. Maximum input current must be limited to ±10 mA. Series connected resistors of at least 500 W on both inputs may be used to limit the maximum input current to ±10 mA. 3. Total power dissipation must be limited to prevent the junction temperature from exceeding the 150°C limit. 4. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150°C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability. Shorting output to either VDD or VSS will adversely affect reliability. 5. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per JEDEC standard JS-001 (AEC−Q100−002) ESD Machine Model tested per JEDEC standard JESD22−A115 (AEC−Q100−003) ESD Charged Device Model tested per JEDEC standard JESD22−C101 (AEC−Q100−011) 6. Latch−up Current tested per JEDEC standard JESD78 (AEC−Q100−004) 7. Moisture Sensitivity Level tested per IPC/JEDEC standard J−STD−020A
THERMAL INFORMATION Single Layer Multi−Layer Parameter Symbol Package Board (Note 8) Board (Note 9) Unit
SOT23−5 / TSOP5 265 195 SOT553−5 325 244 Micro8 / MSOP8 236 167 Junction−to−Ambient q SOIC−8 190 131 JA °C/W TSSOP−8 253 194 SOIC−14 142 101 TSSOP−14 179 128 8. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm2 copper area 9. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area
OPERATING RANGES Parameter Symbol Min Max Unit
Operating Supply Voltage (Single Supply) VS 2.7 36 V Operating Supply Voltage (Split Supply) VS ±1.35 ±18 V Differential Input Voltage (Note 10) VID VS V Input Common Mode Voltage Range VCM VSS VDD − 1.35 V Ambient Temperature TA −40 125 °C Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 10. Maximum input current must be limited to ±10 mA. See Absolute Maximum Ratings for more information.
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