Datasheet TLV2370, TLV2371, TLV2372, TLV2373, TLV2374, TLV2375 (Texas Instruments) - 10
| Hersteller | Texas Instruments |
| Beschreibung | TLV237x 500-µA/Ch, 3-MHz Rail-to-Rail Input and Output Operational Amplifiers With Shutdown |
| Seiten / Seite | 59 / 10 — TLV2370,. TLV2371,. TLV2372. TLV2373,. TLV2374,. TLV2375. www.ti.com. 7.6 … |
| Revision | F |
| Dateiformat / Größe | PDF / 2.4 Mb |
| Dokumentensprache | Englisch |
TLV2370,. TLV2371,. TLV2372. TLV2373,. TLV2374,. TLV2375. www.ti.com. 7.6 Thermal Information: TLV2373. TLV2373. THERMAL METRIC(1)
Textversion des Dokuments
TLV2370, TLV2371, TLV2372 TLV2373, TLV2374, TLV2375
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
www.ti.com 7.6 Thermal Information: TLV2373 TLV2373 THERMAL METRIC(1) DGS (VSSOP) D (SOIC) P (PDIP) UNIT 10 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 166.5 67 66.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 41.8 24.1 20.5 °C/W RθJB Junction-to-board thermal resistance 86.1 22.5 26.8 °C/W ψJT Junction-to-top characterization parameter 1.5 2.2 2.1 °C/W ψJB Junction-to-board characterization parameter 84.7 22.1 26.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.7 Thermal Information: TLV2374 TLV2374 THERMAL METRIC(1) D (SOIC) N (PDIP) PW (TSSOP) UNIT 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 67 66.3 121 °C/W RθJC(top) Junction-to-case (top) thermal resistance 24.1 20.5 49.4 °C/W RθJB Junction-to-board thermal resistance 22.5 26.8 62.8 °C/W ψJT Junction-to-top characterization parameter 2.2 2.1 5.9 °C/W ψJB Junction-to-board characterization parameter 22.1 26.2 62.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.8 Thermal Information: TLV2375 TLV2375 THERMAL METRIC(1) D (SOIC) N (PDIP) PW (TSSOP) UNIT 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 83 55.8 115.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44 43.1 50.5 °C/W RθJB Junction-to-board thermal resistance 40.5 35.8 60.7 °C/W ψJT Junction-to-top characterization parameter 11.5 27.9 7.4 °C/W ψJB Junction-to-board characterization parameter 40.2 35.7 60.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 10 Submit Documentation Feedback Copyright © 2001–2016, Texas Instruments Incorporated Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information
SLOS270F – MARCH 2001 – REVISED AUGUST 2016
www.ti.com 7.6 Thermal Information: TLV2373 TLV2373 THERMAL METRIC(1) DGS (VSSOP) D (SOIC) P (PDIP) UNIT 10 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 166.5 67 66.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 41.8 24.1 20.5 °C/W RθJB Junction-to-board thermal resistance 86.1 22.5 26.8 °C/W ψJT Junction-to-top characterization parameter 1.5 2.2 2.1 °C/W ψJB Junction-to-board characterization parameter 84.7 22.1 26.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.7 Thermal Information: TLV2374 TLV2374 THERMAL METRIC(1) D (SOIC) N (PDIP) PW (TSSOP) UNIT 14 PINS 14 PINS 14 PINS
RθJA Junction-to-ambient thermal resistance 67 66.3 121 °C/W RθJC(top) Junction-to-case (top) thermal resistance 24.1 20.5 49.4 °C/W RθJB Junction-to-board thermal resistance 22.5 26.8 62.8 °C/W ψJT Junction-to-top characterization parameter 2.2 2.1 5.9 °C/W ψJB Junction-to-board characterization parameter 22.1 26.2 62.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
7.8 Thermal Information: TLV2375 TLV2375 THERMAL METRIC(1) D (SOIC) N (PDIP) PW (TSSOP) UNIT 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 83 55.8 115.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44 43.1 50.5 °C/W RθJB Junction-to-board thermal resistance 40.5 35.8 60.7 °C/W ψJT Junction-to-top characterization parameter 11.5 27.9 7.4 °C/W ψJB Junction-to-board characterization parameter 40.2 35.7 60.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 10 Submit Documentation Feedback Copyright © 2001–2016, Texas Instruments Incorporated Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Tables 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 Recommended Operating Conditions 7.3 Thermal Information: TLV2370 7.4 Thermal Information: TLV2371 7.5 Thermal Information: TLV2372 7.6 Thermal Information: TLV2373 7.7 Thermal Information: TLV2374 7.8 Thermal Information: TLV2375 7.9 Electrical Characteristics 7.10 Typical Characteristics 8 Detailed Description 8.1 Overview 8.2 Functional Block Diagram 8.3 Feature Description 8.3.1 Rail-to-Rail Input Operation 8.3.2 Driving a Capacitive Load 8.3.3 Offset Voltage 8.3.4 General Configurations 8.3.5 Shutdown Function 8.4 Device Functional Modes 9 Application and Implementation 9.1 Application Information 9.2 Typical Application 9.2.1 Design Requirements 9.2.2 Detailed Design Procedure 9.2.3 Application Curve 10 Power Supply Recommendations 11 Layout 11.1 Layout Guidelines 11.2 Layout Example 11.3 Power Dissipation Considerations 12 Device and Documentation Support 12.1 Documentation Support 12.1.1 Related Documentation 12.2 Related Links 12.3 Receiving Notification of Documentation Updates 12.4 Community Resources 12.5 Trademarks 12.6 Electrostatic Discharge Caution 12.7 Glossary 13 Mechanical, Packaging, and Orderable Information