Datasheet LF411 (Texas Instruments) - 4

PACKAGE OPTION ADDENDUM
www.ti.com 17-Mar-2017
PACKAGING INFORMATION Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1)
Drawing Qty
(2) (6) (3) (4/5) LF411CD ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C & no Sb/Br) LF411CDG4 ACTIVE SOIC D 8 75 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C & no Sb/Br) LF411CDR ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C & no Sb/Br) LF411CDRG4 ACTIVE SOIC D 8 2500 Green (RoHS CU NIPDAU Level-1-260C-UNLIM 0 to 70 LF411C & no Sb/Br) LF411CP ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 LF411CP (RoHS) LF411CPE4 ACTIVE PDIP P 8 50 Pb-Free CU NIPDAU N / A for Pkg Type 0 to 70 LF411CP (RoHS)
(1)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1