Datasheet LM6181 (Texas Instruments) - 3
| Hersteller | Texas Instruments |
| Beschreibung | 100 mA, 100 MHz Current Feedback Amplifier |
| Seiten / Seite | 39 / 3 — LM6181. www.ti.com. 5 Pin Configuration and Functions. 8–Pin CDIP, PDIP, … |
| Revision | C |
| Dateiformat / Größe | PDF / 2.1 Mb |
| Dokumentensprache | Englisch |
LM6181. www.ti.com. 5 Pin Configuration and Functions. 8–Pin CDIP, PDIP, or SOIC. 16-Pin SOIC. Package NAB, P, or D. Package D
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LM6181 www.ti.com
SNOS634C – MAY 1998 – REVISED SEPTEMBER 2014
5 Pin Configuration and Functions
* indicates heat sinking pins(1)
8–Pin CDIP, PDIP, or SOIC 16-Pin SOIC Package NAB, P, or D Package D (Top View) (Top View) Pin Functions PIN NUMBER I/O DESCRIPTION NAME NAB, P, D (8) D (16)
-IN 2 2 I Inverting Input +IN 3 3 I Non-inverting Input 5, 6, 7 N/C 1, 5, 8 –– No Connection 12, 13, 14, 15 OUTPUT 6 10 O Output V- 4 1, 4, 8, 9, 16 I Negative Supply V+ 7 11 I Positive Supply (1) The typical junction-to-ambient thermal resistance of the molded PDIP package soldered directly into a PC board is 102°C/W. The junction-to-ambient thermal resistance of the SOIC package mounted flush to the PC board is 70°C/W when pins 1, 4, 8, 9 and 16 are soldered to a total 2 in2 1 oz. copper trace. The 16-pin SOIC package must have pin 4 and at least one of pins 1, 8, 9, or 16 connected to V− for proper operation. The typical junction-to-ambient thermal resistance of the SOIC package soldered directly into a PC board is 153°C/W. Copyright © 1998–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM6181 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 Handling Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 ±15V DC Electrical Characteristics 6.6 ±15V AC Electrical Characteristics 6.7 ±5V DC Electrical Characteristics 6.8 ±5V AC Electrical Characteristics 6.9 Typical Performance Characteristics 7 Typical Applications 7.1 Current Feedback Topology 7.2 Power Supply Bypassing and Layout Considerations 7.3 Feedback Resistor Selection: Rf 7.4 Slew Rate Considerations 7.5 Driving Capacitive Loads 7.6 Capacitive Feedback 8 Application and Implementation 8.1 Typical Application 8.1.1 Typical Performance Characteristics 8.1.1.1 Overdrive Recovery 9 Device and Documentation Support 9.1 Trademarks 9.2 Electrostatic Discharge Caution 9.3 Glossary 10 Mechanical, Packaging, and Orderable Information
SNOS634C – MAY 1998 – REVISED SEPTEMBER 2014
5 Pin Configuration and Functions
* indicates heat sinking pins(1)
8–Pin CDIP, PDIP, or SOIC 16-Pin SOIC Package NAB, P, or D Package D (Top View) (Top View) Pin Functions PIN NUMBER I/O DESCRIPTION NAME NAB, P, D (8) D (16)
-IN 2 2 I Inverting Input +IN 3 3 I Non-inverting Input 5, 6, 7 N/C 1, 5, 8 –– No Connection 12, 13, 14, 15 OUTPUT 6 10 O Output V- 4 1, 4, 8, 9, 16 I Negative Supply V+ 7 11 I Positive Supply (1) The typical junction-to-ambient thermal resistance of the molded PDIP package soldered directly into a PC board is 102°C/W. The junction-to-ambient thermal resistance of the SOIC package mounted flush to the PC board is 70°C/W when pins 1, 4, 8, 9 and 16 are soldered to a total 2 in2 1 oz. copper trace. The 16-pin SOIC package must have pin 4 and at least one of pins 1, 8, 9, or 16 connected to V− for proper operation. The typical junction-to-ambient thermal resistance of the SOIC package soldered directly into a PC board is 153°C/W. Copyright © 1998–2014, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Links: LM6181 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 Handling Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information 6.5 ±15V DC Electrical Characteristics 6.6 ±15V AC Electrical Characteristics 6.7 ±5V DC Electrical Characteristics 6.8 ±5V AC Electrical Characteristics 6.9 Typical Performance Characteristics 7 Typical Applications 7.1 Current Feedback Topology 7.2 Power Supply Bypassing and Layout Considerations 7.3 Feedback Resistor Selection: Rf 7.4 Slew Rate Considerations 7.5 Driving Capacitive Loads 7.6 Capacitive Feedback 8 Application and Implementation 8.1 Typical Application 8.1.1 Typical Performance Characteristics 8.1.1.1 Overdrive Recovery 9 Device and Documentation Support 9.1 Trademarks 9.2 Electrostatic Discharge Caution 9.3 Glossary 10 Mechanical, Packaging, and Orderable Information