Datasheet ADP5134 (Analog Devices) - 6
| Hersteller | Analog Devices |
| Beschreibung | Dual 3 MHz, 1200 mA Buck Regulators and Two 300 mA LDO Regulators With Precision Enable and Power-Good Output |
| Seiten / Seite | 28 / 6 — ADP5134. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 6. THERMAL … |
| Revision | A |
| Dateiformat / Größe | PDF / 801 Kb |
| Dokumentensprache | Englisch |
ADP5134. Data Sheet. ABSOLUTE MAXIMUM RATINGS Table 6. THERMAL RESISTANCE. Parameter. Rating. Table 7. Thermal Resistance
Textversion des Dokuments
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ADP5134 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 6. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device AVIN to AGND −0.3 V to +6 V soldered in a circuit board for surface-mount packages. VIN1, VIN2 to AVIN −0.3 V to +0.3 V PGND1, PGND2 to AGND −0.3 V to +0.3 V
Table 7. Thermal Resistance
VIN3, VIN4, VOUT1, VOUT2, FB1, FB2, −0.3 V to (AVIN + 0.3 V)
Package Type θJA θJC Unit
FB3, FB4, EN1, EN2, EN3, EN4, 24-Lead, 0.5 mm Pitch LFCSP 35 3 °C/W MODE, PG to AGND VOUT3 to AGND −0.3 V to (VIN3 + 0.3 V) VOUT4 to AGND −0.3 V to (VIN4 + 0.3 V)
ESD CAUTION
SW1 to PGND1 −0.3 V to (VIN1 + 0.3 V) SW2 to PGND2 −0.3 V to (VIN2 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. Rev. 0 | Page 6 of 28 Document Outline Features Applications Typical Application Circuit General Description Table of Contents Revision History Specifications General Specifications BUCK1 and BUCK2 Specifications LDO1 and LDO2 Specifications Input and Output Capacitor, Recommended Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Power Management Unit Power-Good Output Thermal Protection Undervoltage Lockout Precision Enable and Shutdown Control BUCK1 and BUCK2 Control Scheme PWM Mode Power Save Mode (PSM) PSM Current Threshold Oscillator and Phasing of Inductor Switching Short-Circuit Protection Buck Regulator Soft Start Current Limit 100% Duty Operation Active Pull-Down Resistors LDO1 and LDO2 LDO Regulator Soft Start Applications Information Buck Regulator External Component Selection Feedback Resistors Inductor Output Capacitor Input Capacitor LDO Regulator External Component Selection Feedback Resistors Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Power Dissipation and Thermal Considerations Buck Regulator Power Dissipation LDO Regulator Power Dissipation Junction Temperature PCB Layout Guidelines Typical Application Schematics Bill of Materials Outline Dimensions Ordering Guide
ADP5134 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 6. THERMAL RESISTANCE Parameter Rating
θJA is specified for the worst-case conditions, that is, a device AVIN to AGND −0.3 V to +6 V soldered in a circuit board for surface-mount packages. VIN1, VIN2 to AVIN −0.3 V to +0.3 V PGND1, PGND2 to AGND −0.3 V to +0.3 V
Table 7. Thermal Resistance
VIN3, VIN4, VOUT1, VOUT2, FB1, FB2, −0.3 V to (AVIN + 0.3 V)
Package Type θJA θJC Unit
FB3, FB4, EN1, EN2, EN3, EN4, 24-Lead, 0.5 mm Pitch LFCSP 35 3 °C/W MODE, PG to AGND VOUT3 to AGND −0.3 V to (VIN3 + 0.3 V) VOUT4 to AGND −0.3 V to (VIN4 + 0.3 V)
ESD CAUTION
SW1 to PGND1 −0.3 V to (VIN1 + 0.3 V) SW2 to PGND2 −0.3 V to (VIN2 + 0.3 V) Storage Temperature Range −65°C to +150°C Operating Junction Temperature Range −40°C to +125°C Soldering Conditions JEDEC J-STD-020 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For detailed information on power dissipation, see the Power Dissipation and Thermal Considerations section. Rev. 0 | Page 6 of 28 Document Outline Features Applications Typical Application Circuit General Description Table of Contents Revision History Specifications General Specifications BUCK1 and BUCK2 Specifications LDO1 and LDO2 Specifications Input and Output Capacitor, Recommended Specifications Absolute Maximum Ratings Thermal Resistance ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Theory of Operation Power Management Unit Power-Good Output Thermal Protection Undervoltage Lockout Precision Enable and Shutdown Control BUCK1 and BUCK2 Control Scheme PWM Mode Power Save Mode (PSM) PSM Current Threshold Oscillator and Phasing of Inductor Switching Short-Circuit Protection Buck Regulator Soft Start Current Limit 100% Duty Operation Active Pull-Down Resistors LDO1 and LDO2 LDO Regulator Soft Start Applications Information Buck Regulator External Component Selection Feedback Resistors Inductor Output Capacitor Input Capacitor LDO Regulator External Component Selection Feedback Resistors Output Capacitor Input Bypass Capacitor Input and Output Capacitor Properties Power Dissipation and Thermal Considerations Buck Regulator Power Dissipation LDO Regulator Power Dissipation Junction Temperature PCB Layout Guidelines Typical Application Schematics Bill of Materials Outline Dimensions Ordering Guide