Datasheet ADA4870 (Analog Devices) - 6

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ADA4870 Data Sheet ABSOLUTE MAXIMUM RATINGS MAXIMUM POWER DISSIPATION Table 3. Parameter Rating
The maximum safe power dissipation in the package is limited by Supply Voltage 42 V the associated rise in junction temperature (TJ) on the die. At Power Dissipation See the Power Dissipation approximately 150°C, which is the glass transition temperature, section and the Safe the plastic changes its properties. Exceeding a junction temperature Operating Area section of 150°C can result in changes in the silicon devices, potentially Common-Mode Input Voltage Range VEE to VCC causing failure. Table 4 shows the junction to case thermal Differential Input Voltage Range ±0.7 V resistance (θJC) for the PSOP_3 package. For more detailed Storage Temperature Range −65°C to +150°C information on power dissipation and thermal management, Operating Temperature Range −40°C to +85°C see the Applications Information section. Lead Temperature (Soldering, 10 sec) 300°C
Table 4. Thermal Resistance
Junction Temperature 150°C
Package Type θJC Unit
Stresses at or above those listed under Absolute Maximum 20-Lead PSOP_3 1.1 °C/W Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational
ESD CAUTION
section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. Rev. 0 | Page 6 of 24 Document Outline Features Applications Functional Block Diagram General Description Revision History Specifications ±20 V Supply ±5 V Supply Absolute Maximum Ratings Maximum Power Dissipation ESD Caution Pin Configuration and Function Descriptions Typical Performance Characteristics Applications Information , Initial Power-Up, and Short-Circuit Thermal Protection Shutdown () Feedback Resistor Selection Capacitive Load Driving Heat and Thermal Management Power Dissipation Safe Operating Area Printed Circuit Board (PCB) Thermal Modeling Heat Sink Selection Power Supplies and Decoupling Composite Amplifier Outline Dimensions Ordering Guide