Datasheet MC74AC125, MC74ACT125 (ON Semiconductor) - 8

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS TSSOP−14 WB
CASE 948G 14 ISSUE C DATE 17 FEB 2016 1
SCALE 2:1 14X REF K
NOTES: 1. DIMENSIONING AND TOLERANCING PER 0.10 (0.004) M T U S V S ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 0.15 (0.006) T U S 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT
N
EXCEED 0.15 (0.006) PER SIDE. 0.25 (0.010)
14 8
4. DIMENSION B DOES NOT INCLUDE
2X L/2
INTERLEAD FLASH OR PROTRUSION.
M
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
B
5. DIMENSION K DOES NOT INCLUDE DAMBAR
L
PROTRUSION. ALLOWABLE DAMBAR
−U− N PIN 1
PROTRUSION SHALL BE 0.08 (0.003) TOTAL
IDENT. F
IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.
1 7
6. TERMINAL NUMBERS ARE SHOWN FOR
DETAIL E
REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. 0.15 (0.006) T U S
K A MILLIMETERS INCHES K1 DIM MIN MAX MIN MAX −V− A
4.90 5.10 0.193 0.200
B
4.30 4.50 0.169 0.177
J J1
ÇÇÇ ÉÉÉ
C
−−− 1.20 −−− 0.047
D
0.05 0.15 0.002 0.006 ÇÇÇ ÉÉÉ
F
0.50 0.75 0.020 0.030
SECTION N−N G
0.65 BSC 0.026 BSC
H
0.50 0.60 0.020 0.024
J
0.09 0.20 0.004 0.008
J1
0.09 0.16 0.004 0.006
−W− C K
0.19 0.30 0.007 0.012
K1
0.19 0.25 0.007 0.010
L
6.40 BSC 0.252 BSC 0.10 (0.004)
M
0 _ 8 _ 0 _ 8 _
−T− SEATING D G H DETAIL E PLANE GENERIC MARKING DIAGRAM* RECOMMENDED SOLDERING FOOTPRINT*
14 XXXX 7.06 XXXX ALYWG 1 G 1 A = Assembly Location L = Wafer Lot Y = Year 0.65 W = Work Week PITCH G = Pb−Free Package (Note: Microdot may be in either location) *This information is generic. Please refer to 14X 0.36 14X device data sheet for actual part marking. 1.26 Pb−Free indicator, “G” or microdot “G”, may DIMENSIONS: MILLIMETERS or may not be present. Some products may *For additional information on our Pb−Free strategy and soldering not follow the Generic Marking. details, please download the
onsemi
Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98ASH70246A
Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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