Datasheet SY58608U (Microchip) - 5
| Hersteller | Microchip |
| Beschreibung | 2.5V, high-speed, fully differential 1:2 LVDS fanout buffer optimized to provide two identical output copies with less than 20ps of skew and less than 10psPP total jitter |
| Seiten / Seite | 24 / 5 — SY58608U. TEMPERATURE SPECIFICATIONS. Parameters. Sym. Min. Typ. Max. … |
| Dateiformat / Größe | PDF / 2.7 Mb |
| Dokumentensprache | Englisch |
SY58608U. TEMPERATURE SPECIFICATIONS. Parameters. Sym. Min. Typ. Max. Units. Conditions. Temperature Ranges
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SY58608U TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Operating Ambient Temperature Range TA –40 — +85 °C — Maximum Junction Operating T Temperature J — — +125 °C — Storage Temperature Range TA –65 — +150 °C —
Package Thermal Resistances (Note 1)
Thermal Resistance, 3 x 3 QFN-16Ld JA — 60 — °C/W Still-air JB — 33 — °C/W Junction-to-board
Note 1:
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. JB and JA values are determined for a 4-layer board in still-air number, unless otherwise stated. 2018 Microchip Technology Inc. DS20005605A-page 5 Document Outline 1.0 Electrical Characteristics 2.0 Functional Description 2.1 Fail-Safe Input (FSI) 2.2 Input Clock Failure Case 3.0 Timing Diagrams 4.0 Typical Performance Curves 5.0 Additive Phase Noise Plot 6.0 Input Stage 7.0 Input Interface Applications 8.0 Pin Descriptions 9.0 Packaging Information 9.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service
SY58608U TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Temperature Ranges
Operating Ambient Temperature Range TA –40 — +85 °C — Maximum Junction Operating T Temperature J — — +125 °C — Storage Temperature Range TA –65 — +150 °C —
Package Thermal Resistances (Note 1)
Thermal Resistance, 3 x 3 QFN-16Ld JA — 60 — °C/W Still-air JB — 33 — °C/W Junction-to-board
Note 1:
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB. JB and JA values are determined for a 4-layer board in still-air number, unless otherwise stated. 2018 Microchip Technology Inc. DS20005605A-page 5 Document Outline 1.0 Electrical Characteristics 2.0 Functional Description 2.1 Fail-Safe Input (FSI) 2.2 Input Clock Failure Case 3.0 Timing Diagrams 4.0 Typical Performance Curves 5.0 Additive Phase Noise Plot 6.0 Input Stage 7.0 Input Interface Applications 8.0 Pin Descriptions 9.0 Packaging Information 9.1 Package Marking Information Appendix A: Revision History Product Identification System Worldwide Sales and Service