Datasheet MAX6226 (Analog Devices) - 2

MAX6226
Ultra-High-Precision, Ultra-Low-Noise, Series Voltage Reference
Absolute Maximum Ratings
(All voltages referenced to GND) Operating Temperature Range ... -40°C to +125°C IN ...-0.3V to +13V Junction Temperature ..+150°C OUTF, OUTS, NR ... -0.3V to the lesser of (VIN + 0.3V) or +6V Storage Temperature Range .. -65°C to +150°C Output Short Circuit to GND or IN... 60s Lead Temperature (soldering, 10s) ...+300°C Continuous Power Dissipation (TA = +70°C) Soldering Temperature (reflow) ...+260°C 8-Pin LCC (derate 17.79mW/°C above +70°C) ..1423.5mW Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information LCC PACKAGE CODE L8+2
Outline Number
21-100289
Land Pattern Number
90-100097 Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA) 56.19°C/W Junction to Case (θJC) 8.11°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
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