Datasheet TLV9152 (Texas Instruments) - 3

TLV9151, TLV9152, TL V9154 www.ti.com
SBOS986E – OCTOBER 2019 – REVISED JANUARY 2022 • Expanded the Shutdown section in the Detailed Description section to further clarify shutdown operation and corrected the current consumption in shutdown from 20µA to 30µA and the "typical enable time" in the section from 30µs to 8µs to align with the Electrical Characteristics section..29
Changes from Revision C (December 2020) to Revision D (May 2021) Page
• Changed VSSOP (8) package status on Device Information from Preview to Active ... 1 • Removed preview notation on VSSOP-8 (DGK) package in Pin Configurations and Functions ... 4 • Removed VSSOP-10 (DGS) package in Pin Configurations and Functions ... 4
Changes from Revision B (May 2020) to Revision C (December 2020) Page
• Updated the numbering format for tables, figures and cross-references throughout the document ..1 • Changed SOT-23 (5) package status on Device Information from Preview to Active ... 1 • Changed SC70 (5) package status on Device Information from Preview to Active ...1 • Changed SOT-23 (6) package status on Device Information from Preview to Active ... 1 • Changed SOT-23 (8) package status on Device Information from Preview to Active ... 1 • Changed VSSOP (8) package status on Device Information from Preview to Active ... 1 • Changed SOIC (14) package status on Device Information from Preview to Active ... 1 • Changed TSSOP (14) package status on Device Information from Preview to Active ..1 • Changed X2QFN (14) package status on Device Information from Preview to Active ..1 • Removed preview notation on SOT-23-5 (DBV), SC70-5 (DCK) SOT-23-6 (DBV), and SOT-23-8 (DDF) packages in Pin Configurations and Functions ..4 • Removed preview notation on SOIC-14 (D) package in Pin Configurations and Functions ..4 • Removed preview notation on TSSOP-14 (PW) package in Pin Configurations and Functions ... 4 • Removed preview notation on X2QFN-14 (RUC) package in Pin Configurations and Functions ... 4
Changes from Revision A (March 2020) to Revision B (May 2020) Page
• Changed X2QFN (10) package status on Device Information from Preview to Active ..1 • Removed preview notation on X2QFN (RUG) package in Pin Configurations and Functions .. 4 • Added VIH and VIL in Recommended Operating Conditions section.. 9 • Added SHUTDOWN in Electrical Characteristics table.. 9
Changes from Revision * (October 2019) to Revision A (March 2020) Page
• Changed document status from Advance Information to Production Data ..1 • Changed SOIC (8) package status on Device Information from Preview to Active ... 1 • Changed TSSOP (8) package status on Device Information from Preview to Active ..1 • Changed WSON (8) package status on Device Information from Preview to Active ...1 • Removed preview notation on SOIC-8 (D), TSSOP-8 (PW), and WSON-8 (DSG) packages in Pin Configurations and Functions .. 4 • Added Typical Characteristics section in Specifications section...15 Copyright © 2022 Texas Instruments Incorporated Submit Document Feedback 3 Product Folder Links: TLV9151 TLV9152 TLV9154 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Pin Configuration and Functions 6 Specifications 6.1 Absolute Maximum Ratings 6.2 ESD Ratings 6.3 Recommended Operating Conditions 6.4 Thermal Information for Single Channel 6.5 Thermal Information for Dual Channel 6.6 Thermal Information for Quad Channel 6.7 Electrical Characteristics 6.8 Typical Characteristics 7 Detailed Description 7.1 Overview 7.2 Functional Block Diagram 7.3 Feature Description 7.3.1 EMI Rejection 7.3.2 Thermal Protection 7.3.3 Capacitive Load and Stability 7.3.4 Common-Mode Voltage Range 7.3.5 Phase Reversal Protection 7.3.6 Electrical Overstress 7.3.7 Overload Recovery 7.3.8 Typical Specifications and Distributions 7.3.9 Packages With an Exposed Thermal Pad 7.3.10 Shutdown 7.4 Device Functional Modes 8 Application and Implementation 8.1 Application Information 8.2 Typical Applications 8.2.1 Low-Side Current Measurement 8.2.1.1 Design Requirements 8.2.1.2 Detailed Design Procedure 8.2.1.3 Application Curves 9 Power Supply Recommendations 10 Layout 10.1 Layout Guidelines 10.2 Layout Example 11 Device and Documentation Support 11.1 Device Support 11.1.1 Development Support 11.1.1.1 TINA-TI™ (Free Software Download) 11.1.1.2 TI Precision Designs 11.2 Documentation Support 11.2.1 Related Documentation 11.3 Receiving Notification of Documentation Updates 11.4 Support Resources 11.5 Trademarks 11.6 Electrostatic Discharge Caution 11.7 Glossary 12 Mechanical, Packaging, and Orderable Information