Datasheet MAX17579, MAX17580 (Analog Devices) - 2

MAX17579/MAX17580 4.5V to 60V, 300mA High-Efficiency, Synchronous, Inverting Output DC-DC Converters
Absolute Maximum Ratings
IN, GND, EN/UVLO to OUT .. -0.3V to +65V OUT to SOUT .. -0.3V to +0.3V IN to GND ... -0.3V to +65V LX Total RMS Current ..0.53A EN/UVLO to GND ...-0.3 to (VIN + 0.3V) Output Short-Circuit Duration ..Continuous RESET to GND .. -0.3V to +6.5V Continuous Power Dissipation (Multilayer Board) (TA = +70°C, LX to OUT .. -0.3V to (VIN + |VOUT| + 0.3V) derate 24.4mW/°C above +70°C) ..1951.2mW RESET, BST to OUT .. -0.3V to +70V Operating Temperature Range (Note 1) ...-40°C to +125°C BST to LX .. -0.3V to +6.5V Junction Temperature ... +150°C BST to VCC ... -0.3V to +65V Storage Temperature Range ..-65°C to +150°C FB, SS, VCC to SOUT ... -0.3V to +6.5V Lead Temperature ((soldering, 10s)) ..+300°C RT/SYNC to SOUT ... -2V to +6.5V Soldering Temperature (reflow) ..+260°C
Note 1:
Junction temperature greater than +125°C degrades operating lifetimes. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Information TDFN-EP
Package Code TD1233+1C Outline Number 21-0664 Land Pattern Number 90-0397
THERMAL RESISTANCE, FOUR-LAYER BOARD
Junction-to-Ambient (θJA) 41ºC/W Junction-to-Case Thermal Resistance (θJC) 8.5ºC/W For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/ thermal-tutorial. www.analog.com Analog Devices | 2 Document Outline General Description Applications Benefits and Features Simplified Application Circuit Absolute Maximum Ratings Package Information TDFN-EP Electrical Characteristics Electrical Characteristics (continued) Typical Operating Characteristics Typical Operating Characteristics (continued) Pin Configuration MAX17579, MAX17580 Pin Description Functional Diagrams MAX17579/MAX17580 Block Diagram Detailed Description Switching Frequency and External Clock Synchronization Linear Regulator (VCC) Operating Input-Voltage Range Overcurrent Protection (OCP)/Hiccup Mode RESET Output Prebiased Output Thermal-Shutdown Protection Applications Information Inductor Selection Load Current Capability (IOUT(MAX)) Input Capacitor Selection Output Capacitor Selection Soft-Start Capacitor Selection Adjusting Output Voltage Setting the Input Undervoltage-Lockout Level Soft-Start Inductive Output Short-Circuit Protection Power Dissipation PCB Layout Guidelines Typical Application Circuits -5V Typical Application Circuits Typical Application Circuits (continued) -15V Typical Application Circuit Ordering Information Revision History