Datasheet MAX6043 (Analog Devices) - 2
| Hersteller | Analog Devices |
| Beschreibung | Precision High-Voltage Reference in SOT23 |
| Seiten / Seite | 16 / 2 — MAX6043. Absolute Maximum Ratings. Package Information 6 SOT23. PACKAGE … |
| Dateiformat / Größe | PDF / 2.5 Mb |
| Dokumentensprache | Englisch |
MAX6043. Absolute Maximum Ratings. Package Information 6 SOT23. PACKAGE CODE. U6F+6. 21-0058. 90-0175
Modelllinie für dieses Datenblatt
- MAX6043BAUT10+ MAX6043BAUT10+T MAX6043BAUT25+ MAX6043BAUT25+T MAX6043BAUT33+ MAX6043BAUT33+T MAX6043BAUT41+ MAX6043BAUT41+T MAX6043BAUT50+ MAX6043BAUT50+T MAX6043CAUT10+ MAX6043CAUT10+T MAX6043CAUT25+ MAX6043CAUT25+T MAX6043CAUT33+ MAX6043CAUT33+T MAX6043CAUT41+ MAX6043CAUT41+T MAX6043CAUT50+ MAX6043CAUT50+T
Textversion des Dokuments
MAX6043
Precision High-Voltage Reference in SOT23
Absolute Maximum Ratings
IN to GND ..-0.3V to +42V Junction Temperature Range ... -65°C to +150°C OUTF, OUTS to GND ...-0.3V to (VIN + 0.3V) Maximum Junction Temperature ...+150°C Continuous Power Dissipation (TA = +70°C) Lead Temperature (soldering, 10s) ...+300°C 6-Pin SOT23 (derate 7.40mW/°C above +70°C) ...595.20mW Soldering Temperature (reflow) OUT_ Short-Circuit Duration ... 5s RoHS-compliant package ..+245°C Operating Temperature Range ... -40°C to +125°C Packages containing lead(Pb) ...+240°C Storage Temperature Range .. -65°C to +150°C
Package Information 6 SOT23 PACKAGE CODE U6F+6
Outline Number
21-0058
Land Pattern Number
90-0175 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 185.50°C/W Junction to Case (θJC) 75°C/W
Thermal Resistance, Four-Layer Board
Junction to Ambient (θJA) 134.40°C/W Junction to Case (θJC) 39°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.analog.com Analog Devices │ 2
Precision High-Voltage Reference in SOT23
Absolute Maximum Ratings
IN to GND ..-0.3V to +42V Junction Temperature Range ... -65°C to +150°C OUTF, OUTS to GND ...-0.3V to (VIN + 0.3V) Maximum Junction Temperature ...+150°C Continuous Power Dissipation (TA = +70°C) Lead Temperature (soldering, 10s) ...+300°C 6-Pin SOT23 (derate 7.40mW/°C above +70°C) ...595.20mW Soldering Temperature (reflow) OUT_ Short-Circuit Duration ... 5s RoHS-compliant package ..+245°C Operating Temperature Range ... -40°C to +125°C Packages containing lead(Pb) ...+240°C Storage Temperature Range .. -65°C to +150°C
Package Information 6 SOT23 PACKAGE CODE U6F+6
Outline Number
21-0058
Land Pattern Number
90-0175 Thermal Resistance, Single-Layer Board
Junction to Ambient (θJA) 185.50°C/W Junction to Case (θJC) 75°C/W
Thermal Resistance, Four-Layer Board
Junction to Ambient (θJA) 134.40°C/W Junction to Case (θJC) 39°C/W For the latest package outline information and land patterns (footprints), go to
www.maximintegrated.com/packages
. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial
. www.analog.com Analog Devices │ 2