Datasheet ADRF5030 (Analog Devices) - 5

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ADRF5030 ABSOLUTE MAXIMUM RATINGS
For the recommended operating conditions, see Table 1.
THERMAL RESISTANCE Table 3. Absolute Maximum Ratings
Thermal performance is directly linked to printed circuit board
Parameter Rating
(PCB) design and operating environment. Careful attention to PCB Positive Supply Voltage −0.3 V to +3.6 V thermal design is required. Negative Supply Voltage −3.6 V to +0.3 V θJC is the junction-to-case bottom (channel-to-package bottom) Digital Control Input1 thermal resistance. Voltage −0.3 V to VDD + 0.3 V
Table 4. Thermal Resistance
Current 3 mA
Package Type θ 1 Unit
RF Input Power, Dual Supply2 (V
JC
DD = 3.3 V, VSS = −3.3 V, f = 0.1 GHz to 20 GHz, T CC-20-21, Through Path 93 °C/W CASE = 85°C3) Through Path CC-20-21, Terminated Path 25 °C/W Average 34 dBm 1 θJC was determined by simulation under the following conditions: the heat Peak 37 dBm transfer is due solely to the thermal conduction from the channel through the Terminated Path ground pad to the PCB, and the ground pad is held constant at the operating Average 33.5 dBm temperature of 85°C. Peak 36.5 dBm
POWER DERATING CURVES
Hot Switching Average 34 dBm Peak 37 dBm RF Input Power, Single Supply (VDD = 3.3 V, VSS = 0 V, f = 0.1 GHz to 20 GHz, TCASE = 85°C3) Through Path 23 dBm Terminated Path 23 dBm Hot Switching 23 dBm RF Input Power, Unbiased (VDD, VSS = 0 V) Average 31 dBm Peak4 37 dBm Temperature Junction, TJ 135°C Storage Range −65°C to +150°C Reflow 260°C
Figure 2. Power Derating vs. Frequency, Low-Frequency Detail, TCASE = 85°
1 Overvoltages at the digital control input are clamped by internal diodes.
ELECTROSTATIC DISCHARGE (ESD) RATINGS
Current must be limited to the maximum rating given. 2 The following ESD information is provided for handling of ESD-sen- For power derating over frequency, see Figure 2. sitive devices in an ESD-protected area only. 3 For 105°C operation, the power handling degrades from the TCASE = 85°C specification by 3 dB for dual supply. Human body model (HBM) per ANSI/ESDA/JEDEC JS-001. Charg- 4 Peak: (≤100 ns pulse duration, 5% duty cycle) ed device model (CDM) ratings are per ANSI/ESDA/JEDEC JS-002. Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress
ESD Ratings for the ADRF5030
rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this
Table 5. ADRF5030, 20-Terminal LGA
specification is not implied. Operation beyond the maximum operat-
ESD Model Withstand Threshold (V) Class
ing conditions for extended periods may affect product reliability. HBM 1.5 kV for RF pins 1C Only one absolute maximum rating can be applied at any one time. 2 kV for supply and digital 2 control pins CDM 500 V for all pins C2A
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Document Outline Features Applications Functional Block Diagram General Description Specifications Single-Supply Operation Absolute Maximum Ratings Thermal Resistance Power Derating Curves Electrostatic Discharge (ESD) Ratings ESD Ratings for the ADRF5030 ESD Caution Pin Configuration and Function Descriptions Interface Schematics Typical Performance Characteristics Insertion Loss, Return Loss, and Isolation Input Power Compression and Third-Order Intercept Theory of Operation RF Input and Output Power Supply Applications Information Recommendations for Printed Circuit Board Design Outline Dimensions Ordering Guide Notes