Datasheet BTA206X-800ET (WeEn Semiconductors) - 5

WeEn Semiconductors BTA206X-800ET 3Q Hi-Com Triac 9. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit
Rth(j-h) thermal resistance full cycle or half cycle; with heatsink - - 4.5 K/W from junction to compound; Fig. 6 heatsink full cycle or half cycle; without heatsink - - 6.5 K/W compound; Fig. 6 Rth(j-a) thermal resistance in free air - 60 - K/W from junction to ambient 003aaf915 10 Zth(j-h) (1) (2) (K/W) 1 (3) (4) 10- 1 P 10- 2 tp t 10- 310-5 10- 1 10- 2 10- 4 10- 3 1 10 tp (s) (1) Unidirectional (half cycle) without heatsink compound (2) Unidirectional (half cycle) with heatsink compound (3) Bidirectional (full cycle) without heatsink compound (4) Bidirectional (full cycle) with heatsink compound
Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse duration 10. Isolation characteristics Table 7. Isolation Characteristics Symbol Parameter Conditions Min Typ Max Unit
Visol(RMS) RMS isolation voltage from all terminals to external heatsink; - - 2500 V sinusoidal waveform; clean and dust free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; Tmb = 25 °C Cisol isolation capacitance from main terminal 2 to external - 10 - pF heatsink; f = 1 MHz; Tmb = 25 °C BTA206X-800ET All information provided in this document is subject to legal disclaimers. © WeEn Semiconductors Co., Ltd. 2023. All rights reserved
Product data sheet 28 August 2023 5 / 12
Document Outline 1. General description 2. Features and benefits 3. Applications 4. Quick reference data 5. Pinning information 6. Ordering information 7. Marking 8. Limiting values 9. Thermal characteristics 10. Isolation characteristics 11. Characteristics 12. Package outline 13. Legal information 14. Contents