Datasheet STGAP3S6I (STMicroelectronics) - 8

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STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS Electrical characteristics Symbol Pin Parameter Test conditions Min. Typ. Max. Unit
VCLAMPdrv_H CLAMPdrv CLAMP high-level output vs. VL No load, VHL < 7.5 V - VH - 1 - V VCLAMPdrv_L CLAMPdrv CLAMP low-level output vs. VL ICLAMP = 10 mA - 60 - mV t Miller clamp driver intervention CLAMPdrv CLAMPdrv - 50 - ns time
Desaturation protection
STGAP3SxSx 5.70 6.00 6.30 VDESATth DESAT Desaturation threshold V STGAP3SxIx 8.55 9.00 9.45 IDESAT DESAT DESAT blanking charge current VDESAT = 0 V 0.93 1.00 1.10 mA I DESAT blanking discharge DESoff DESAT V current DESAT = 8 V, IN+ = GND 110 150 195 mA Step on DESAT pin: tDESfilter DESAT DESAT pin deglitch filter - 120 - ns 0 → (VDESATth+ 1 V) t DESAT protection fixed blanking BLK DESAT (3) 180 200 220 ns time (3) Step on DESAT pin: t DESAT protection intervention DESAT DESAT 80 150 220 ns time 0 → (VDESATth+ 1 V) Time from step to SOFTOFF / GOUT 90%, No load tDIAG DIAG DESAT event to DIAG low delay (3) - - 2.5 μs
SOFTOFF
TJ = 25 °C 700 800 900 I Soft turn-off current on fault STO SOFTOFF mA conditions -40 °C ≤ TJ ≤ 125 °C (2) 550 - 1100 tSOFTOFF SOFTOFF Soft turn-off time (3) 4 5 6 μs
Overtemperature protection
TSD Shutdown temperature 164 - - °C Thys Temperature hysteresis - 20 - °C t Overtemperature to RDY low OT-RDY See Figure 12 10 15 20 μs delay t Overtemperature to GOUT low OT-GOUT See Figure 12 1.5 2.5 3.5 μs delay
Diagnostic
IDIAG DIAG DIAG low-level sink current VDIAG = 0.4 V 20 30 40 mA IRDY RDY RDY low-level sink current VRDY = 0.4 V 20 30 40 mA R DIAG, DIAG_pu DIAG & RDY pull-up resistor DIAG, RDY = GND 35 55 72 kΩ RDY 1. See Figure 16. 2. Characterization data, not tested in production. 3. See Figure 11.
DS14758
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Rev 1 page 8/32
Document Outline STGAP3S6I, STGAP3S6S, STGAP3SXI, STGAP3SXS @NA Cover image @NA Device summary Features Applications Description 1 Block diagram 2 Pin description and connection diagram 3 Device ratings 3.1 Absolute maximum ratings 3.2 Thermal data 3.3 Recommended operating conditions 4 Electrical characteristics 5 Isolation 6 Functional description 6.1 Power supplies and UVLO 6.2 Power-up, power-down, and “safe state” 6.3 Control inputs 6.3.1 Anti cross conduction interlocking 6.4 Miller clamp function 6.4.1 Miller clamp driver 6.5 Desaturation protection 6.5.1 Adjustable soft turn-off function 6.6 Watchdog 6.7 Thermal shutdown protection 7 Typical application diagram 8 PCB layout 8.1 Layout guidelines and considerations 8.2 Layout example 9 Unused functions 10 Testing and characterization information 11 Package information 11.1 SO-16W package information 11.2 SO-16W suggested land pattern 12 Ordering information Revision history Contents List of tables List of figures