Datasheet REF3425, REF3430, REF3433, REF3440, REF3450 (Texas Instruments) - 10

REF3425 , REF3430, REF3433, REF3440, REF3450
SBAS804F – SEPTEMBER 2017 – REVISED JUNE 2021
www.ti.com 7.6 Typical Characteristics (continued)
at TA = 25°C, VIN = VEN = 12 V, IL = 0 mA, CL = 10 µF, CIN = 0.1 µF (unless otherwise noted) 8.7 55 ) 8.4 ) 52.5 mA 8.1 mA 50 (ppm/ 7.8 (ppm/ 47.5 ing ing rc 7.5 k 45 Sou 7.2 Sin 42.5 ion ion 6.9 40 6.6 egulat 37.5 egulat R R 6.3 35 Load Load 6 32.5 5.7 30 -40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140 Temperature (°C) Temperature (°C) D020 D021
Figure 7-7. Load Regulation Sourcing Figure 7-8. Load Regulation Sinking
ILOAD +1mA +1mA -1mA 1mA/div VOUT 4mV/div 250µs/div (CL = 1µF, IOUT = 1mA) D010
Figure 7-9. Noise Performance 10 Hz to 10 kHz Figure 7-10. Load Transient
I I LOAD LOAD +1mA +1mA +10mA +10mA 10mA/div -1mA -10mA 1mA/div V VOUT OUT 100mV/div 4mV/div 250µs/div 250µs/div (CL = 1µF, IOUT = 10mA) D010 (CL = 10µF, IOUT = 1mA) D010
Figure 7-12. Load Transient Figure 7-11. Load Transient
10 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: REF3425 REF3430 REF3433 REF3440 REF3450 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Typical Characteristics 8 Parameter Measurement Information 8.1 Solder Heat Shift 8.2 Long-Term Stability 8.3 Thermal Hysteresis 8.4 Power Dissipation 8.5 Noise Performance 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Supply Voltage 9.3.2 Low Temperature Drift 9.3.3 Load Current 9.4 Device Functional Modes 9.4.1 EN Pin 9.4.2 Negative Reference Voltage 10 Application and Implementation 10.1 Application Information 10.2 Typical Application: Basic Voltage Reference Connection 10.2.1 Design Requirements 10.2.2 Detailed Design Procedure 10.2.2.1 Input and Output Capacitors 10.2.2.2 4-Wire Kelvin Connections 10.2.2.3 VIN Slew Rate Considerations 10.2.2.4 Shutdown/Enable Feature 10.2.3 Application Curves 11 Power Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation 13.2 Receiving Notification of Documentation Updates 13.3 Support Resources 13.4 Trademarks 13.5 Electrostatic Discharge Caution 13.6 Glossary 14 Mechanical, Packaging, and Orderable Information