Datasheet REF3430 (Texas Instruments) - 6

link to page 6 link to page 6 link to page 6 link to page 6
REF3425 , REF3430, REF3433, REF3440, REF3450
SBAS804F – SEPTEMBER 2017 – REVISED JUNE 2021
www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
IN –0.3 13 V Input voltage EN –0.3 IN + 0.3 V Output voltage VOUT –0.3 5.5 V Output short circuit current ISC 20 mA Operating temperature range TA –55 150 °C Storage temperature range Tstg –65 170 °C (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. These are stress ratings only and functional operation of the device at these or any other conditions beyond those specified in the Electrical Characteristics Table is not implied.
7.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/ JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
V IN Input Voltage OUT + V (1) 12 V DO EN Enable Voltage 0 IN V IL Output Current –10 10 mA TA Operating Temperature –40 25 125 °C (1) VDO = Dropout voltage
7.4 Thermal Information REF34T REF34 THERMAL METRIC(1) DBV DBV UNIT 6 PINS 6 PINS
RθJA Junction-to-ambient thermal resistance 122.6 122.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 80.2 80.2 °C/W RθJB Junction-to-board thermal resistance 42 42 °C/W ΨJT Junction-to-top characterization parameter 23.2 23.2 °C/W ΨJB Junction-to-board characterization parameter 41.9 41.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W 6 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: REF3425 REF3430 REF3433 REF3440 REF3450 Document Outline 1 Features 2 Applications 3 Description Table of Contents 4 Revision History 5 Device Comparison Table 6 Pin Configuration and Functions 7 Specifications 7.1 Absolute Maximum Ratings 7.2 ESD Ratings 7.3 Recommended Operating Conditions 7.4 Thermal Information 7.5 Electrical Characteristics 7.6 Typical Characteristics 8 Parameter Measurement Information 8.1 Solder Heat Shift 8.2 Long-Term Stability 8.3 Thermal Hysteresis 8.4 Power Dissipation 8.5 Noise Performance 9 Detailed Description 9.1 Overview 9.2 Functional Block Diagram 9.3 Feature Description 9.3.1 Supply Voltage 9.3.2 Low Temperature Drift 9.3.3 Load Current 9.4 Device Functional Modes 9.4.1 EN Pin 9.4.2 Negative Reference Voltage 10 Application and Implementation 10.1 Application Information 10.2 Typical Application: Basic Voltage Reference Connection 10.2.1 Design Requirements 10.2.2 Detailed Design Procedure 10.2.2.1 Input and Output Capacitors 10.2.2.2 4-Wire Kelvin Connections 10.2.2.3 VIN Slew Rate Considerations 10.2.2.4 Shutdown/Enable Feature 10.2.3 Application Curves 11 Power Supply Recommendations 12 Layout 12.1 Layout Guidelines 12.2 Layout Example 13 Device and Documentation Support 13.1 Documentation Support 13.1.1 Related Documentation 13.2 Receiving Notification of Documentation Updates 13.3 Support Resources 13.4 Trademarks 13.5 Electrostatic Discharge Caution 13.6 Glossary 14 Mechanical, Packaging, and Orderable Information