Datasheet AL58221 (Diodes) - 4
| Hersteller | Diodes |
| Beschreibung | 12-Channel RGB LED Driver |
| Seiten / Seite | 26 / 4 — AL58221. Absolute Maximum Ratings. Symbol. Parameters. Ratings. Unit. ESD … |
| Dateiformat / Größe | PDF / 861 Kb |
| Dokumentensprache | Englisch |
AL58221. Absolute Maximum Ratings. Symbol. Parameters. Ratings. Unit. ESD Ratings. Parameter. Rating. Package Thermal Data. Package
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AL58221 Absolute Maximum Ratings
(@TA = +25°C, Tj (max) = 150°C unless otherwise specified.) (Note 4, 5, 6)
Symbol Parameters Ratings Unit
VDD Supply Voltage -0.3 ~ 7.0 V VDI, VDCKI, VGCKI Input Voltage -0.3 ~ VDD+0.3 V IOUT Output Current 62 mA VOUT_off Output Voltage @ Turn-off -0.3 ~ 24 V VOUT_on Output Voltage @ Turn-on -0.3 ~ 5.5 V FDCK Input Data Clock Frequency 0.07 ~ 10 MHz FGCK Input Grayscale Clock Frequency 10 MHz IGND GND Terminal Current 750 mA Notes: 4. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only and functional operation of the device at these or any other condition beyond those specified is not supported. 5. All voltage values are with respect to ground terminal. 6. Operation at Tj(max) = 150°C may reduce the device reliability; therefore, the suggested junction temperature of the device is under 125 °C.
ESD Ratings Symbol Parameter Rating Unit
Human-Body Model (HBM) 2000 V VESD Charged-Device Model (CDM) 750 V
Package Thermal Data
(Note 7)
θ θ P Package JC Thermal Resistance JA Thermal Resistance DIS Junction-to-Case (°C/W) Junction-to-Ambient (°C/W) TA = +25°C, TJ = +105°C
TSSOP-24EP (Type A1-B) 15 28 2.86 Note: 7. Test condition: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
Recommended Operating Conditions
(@TA = +25°C, unless otherwise specified.)
Symbol Parameter Min Typ Max Unit
VDD Operating supply voltage 3.0 3.3 5.5 V IOUT Output Current (Note 8) 3 — 60 mA VOUT Output Voltage 1 — 24 V TA Ambient temperature (Note 8) -40 — +85 °C TJ Junction temperature -40 — +125 °C Tstg Storage Temperature -55 — +150 °C Note: 8. Dependent on ambient temperature, LED voltage, package thermal limitation, and PCB layout. AL58221 4 of 26 April 2024 Document number: DS46476 Rev. 2 - 2
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(@TA = +25°C, Tj (max) = 150°C unless otherwise specified.) (Note 4, 5, 6)
Symbol Parameters Ratings Unit
VDD Supply Voltage -0.3 ~ 7.0 V VDI, VDCKI, VGCKI Input Voltage -0.3 ~ VDD+0.3 V IOUT Output Current 62 mA VOUT_off Output Voltage @ Turn-off -0.3 ~ 24 V VOUT_on Output Voltage @ Turn-on -0.3 ~ 5.5 V FDCK Input Data Clock Frequency 0.07 ~ 10 MHz FGCK Input Grayscale Clock Frequency 10 MHz IGND GND Terminal Current 750 mA Notes: 4. Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only and functional operation of the device at these or any other condition beyond those specified is not supported. 5. All voltage values are with respect to ground terminal. 6. Operation at Tj(max) = 150°C may reduce the device reliability; therefore, the suggested junction temperature of the device is under 125 °C.
ESD Ratings Symbol Parameter Rating Unit
Human-Body Model (HBM) 2000 V VESD Charged-Device Model (CDM) 750 V
Package Thermal Data
(Note 7)
θ θ P Package JC Thermal Resistance JA Thermal Resistance DIS Junction-to-Case (°C/W) Junction-to-Ambient (°C/W) TA = +25°C, TJ = +105°C
TSSOP-24EP (Type A1-B) 15 28 2.86 Note: 7. Test condition: Device mounted on FR-4 PCB (51mm x 51mm 2oz copper, minimum recommended pad layout on top layer and thermal vias to bottom layer with maximum area ground plane. For better thermal performance, larger copper pad for heat-sink is needed
Recommended Operating Conditions
(@TA = +25°C, unless otherwise specified.)
Symbol Parameter Min Typ Max Unit
VDD Operating supply voltage 3.0 3.3 5.5 V IOUT Output Current (Note 8) 3 — 60 mA VOUT Output Voltage 1 — 24 V TA Ambient temperature (Note 8) -40 — +85 °C TJ Junction temperature -40 — +125 °C Tstg Storage Temperature -55 — +150 °C Note: 8. Dependent on ambient temperature, LED voltage, package thermal limitation, and PCB layout. AL58221 4 of 26 April 2024 Document number: DS46476 Rev. 2 - 2
www.diodes.com
© 2024 Copyright Diodes Incorporated. All Rights Reserved.