Datasheet MC74AC132, MC74ACT132 (ON Semiconductor) - 2
| Hersteller | ON Semiconductor |
| Beschreibung | Quad 2-Input NAND Schmitt Trigger |
| Seiten / Seite | 8 / 2 — MC74AC132, MC74ACT132. MAXIMUM RATINGS. Symbol. Parameter. Value. Unit. … |
| Dateiformat / Größe | PDF / 201 Kb |
| Dokumentensprache | Englisch |
MC74AC132, MC74ACT132. MAXIMUM RATINGS. Symbol. Parameter. Value. Unit. RECOMMENDED OPERATING CONDITIONS. Min. Typ. Max. www.onsemi.com
Modelllinie für dieses Datenblatt
Textversion des Dokuments
link to page 2 link to page 2 link to page 2 link to page 2 link to page 2 link to page 2 link to page 2
MC74AC132, MC74ACT132 MAXIMUM RATINGS Symbol Parameter Value Unit
VCC DC Supply Voltage *0.5 to +6.5 V VI DC Input Voltage *0.5 v VI v VCC )0.5 V VO DC Output Voltage (Note 1) *0.5 v VO v VCC )0.5 V IIK DC Input Diode Current $20 mA IOK DC Output Diode Current $50 mA IO DC Output Sink/Source Current $50 mA ICC DC Supply Current per Output Pin $50 mA IGND DC Ground Current per Output Pin $50 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction temperature under Bias )150 °C qJA Thermal Resistance (Note 2) 116 °C/W PD Power Dissipation in Still Air at 25°C 1077 mW MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 3) > 2000 V Charged Device Model (Note 4) > 1000 ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 5) $100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD51−7. 3. Tested to EIA/JESD22−A114−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit
′AC 2.0 5.0 6.0 VCC Supply Voltage V ′ACT 4.5 5.0 5.5 Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) 0 − VCC V VCC @ 3.0 V − 150 − t Input Rise and Fall Time (Note 1) r, tf V ′AC Devices except Schmitt Inputs CC @ 4.5 V − 40 − ns/V VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − t Input Rise and Fall Time (Note 2) r, tf ns/V ′ACT Devices except Schmitt Inputs VCC @ 5.5 V − 8.0 − TA Operating Ambient Temperature Range −40 25 85 °C IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
www.onsemi.com 2
MC74AC132, MC74ACT132 MAXIMUM RATINGS Symbol Parameter Value Unit
VCC DC Supply Voltage *0.5 to +6.5 V VI DC Input Voltage *0.5 v VI v VCC )0.5 V VO DC Output Voltage (Note 1) *0.5 v VO v VCC )0.5 V IIK DC Input Diode Current $20 mA IOK DC Output Diode Current $50 mA IO DC Output Sink/Source Current $50 mA ICC DC Supply Current per Output Pin $50 mA IGND DC Ground Current per Output Pin $50 mA TSTG Storage Temperature Range *65 to )150 °C TL Lead temperature, 1 mm from Case for 10 Seconds 260 °C TJ Junction temperature under Bias )150 °C qJA Thermal Resistance (Note 2) 116 °C/W PD Power Dissipation in Still Air at 25°C 1077 mW MSL Moisture Sensitivity Level 1 FR Flammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in VESD ESD Withstand Voltage Human Body Model (Note 3) > 2000 V Charged Device Model (Note 4) > 1000 ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 5) $100 mA Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. 2. The package thermal impedance is calculated in accordance with JESD51−7. 3. Tested to EIA/JESD22−A114−A. 4. Tested to JESD22−C101−A. 5. Tested to EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit
′AC 2.0 5.0 6.0 VCC Supply Voltage V ′ACT 4.5 5.0 5.5 Vin, Vout DC Input Voltage, Output Voltage (Ref. to GND) 0 − VCC V VCC @ 3.0 V − 150 − t Input Rise and Fall Time (Note 1) r, tf V ′AC Devices except Schmitt Inputs CC @ 4.5 V − 40 − ns/V VCC @ 5.5 V − 25 − VCC @ 4.5 V − 10 − t Input Rise and Fall Time (Note 2) r, tf ns/V ′ACT Devices except Schmitt Inputs VCC @ 5.5 V − 8.0 − TA Operating Ambient Temperature Range −40 25 85 °C IOH Output Current − High − − −24 mA IOL Output Current − Low − − 24 mA Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times. 2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.
www.onsemi.com 2